3dic Packaging Si Pi Applications Engineer in united states (1000+)
3 months ago
3DIC Packaging SI/PI Applications Engineer
Siemens EDA (Siemens Digital Industries Software)
/
Late Stage
Less than 25 applicants
No H1B
1 day agoBe an early applicant
Senior Silicon Application Engineer (Packaging Design)
Intel Corporation
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Late Stage
Less than 25 applicants
No H1B
1 day agoBe an early applicant
Application Specific Integrated Circuit Design Engineer
Dexian
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Information Technology & Services · Late Stage
Less than 25 applicants
2 months ago
Advanced Packaging SI/PI Staff Engineer
Marvell Technology
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Semiconductors · Public
Less than 25 applicants
1 week ago
Senior/Returnship, Signal Integrity (SI) and Power Integrity (PI) - Principal Applications Engineer
Cadence
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Computer Software · Public
57 applicants
1 week ago
Package & SI/PI - Hardware Board Designer/PCB Design Engineer
Eliyan Corporation
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Semiconductors · Growth Stage
56 applicants
2 weeks ago
Application-Specific Integrated Circuit (ASIC) Engineer Internship – 2026 (US)
Amazon
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Computer Software · Public
200+ applicants
2 days ago
Application Specific Integrated Circuit Engineer
Net2Source (N2S)
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Staffing & Recruiting · Late Stage
85 applicants
1 week ago
Application Specific Integrated Circuit Design Engineer
Mirafra Technologies
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Semiconductors · Late Stage
133 applicants
2 days agoBe an early applicant
Application Specific Integrated Circuit Verification Engineer
ACL Digital
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Information Technology & Services · Late Stage
Less than 25 applicants
2 weeks ago
Advanced Packaging SI/PI Senior Engineer
Marvell Technology
/
Semiconductors · Public
Less than 25 applicants
No H1B
5 days ago
Package & SI/PI - Signal and Power Integrity Engineer
Eliyan Corporation
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Semiconductors · Growth Stage
73 applicants
2 days ago
Application Specific Integrated Circuit Engineer
Net2Source (N2S)
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Staffing & Recruiting · Late Stage
37 applicants
1 month ago
Application-Specific Integrated Circuit (ASIC) Engineer Internship – 2026 (US)
Amazon
/
Computer Software · Public
91 applicants
3 days agoBe an early applicant
Advanced Packaging, SI/PI Principal Engineer
Marvell Technology
/
Semiconductors · Public
Less than 25 applicants
2 weeks ago
Package & SI/PI - Senior/Staff Packaging Engineer - Electro-Thermal
Eliyan Corporation
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Semiconductors · Growth Stage
47 applicants
2 days agoBe an early applicant
Application Specific Integrated Circuit Design Engineer
BCforward
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Information Technology & Services · Late Stage
Less than 25 applicants
No H1B
1 month ago
Advanced Packaging, SI/PI Principal Engineer
Marvell Technology
/
Semiconductors · Public
Less than 25 applicants
5 days ago
Application Specific Integrated Circuit Verification Engineer
Technical-Link N. America
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Staffing & Recruiting · Growth Stage
66 applicants
5 hours ago
Industrial/Semiconductor Mechanical Designer
Farnsworth Group, Inc.
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Late Stage
200+ applicants