Lead Rfic Advanced Packaging Engineer in united states (1000+)
3 weeks ago
Lead RFIC Advanced Packaging Engineer
Lockheed Martin
/
National Defense · Cyber Security · Public
Less than 25 applicants
1 week ago
Advanced Lead – SiC/GaN Power Module Packaging Engineer
GE Aerospace
/
Aerospace · Manufacturing · Public
Less than 25 applicants
No H1B
4 months ago
Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration
ALTEN
/
Information Technology · Public
Less than 25 applicants
3 days ago
Senior Principal Analog Power Management Integrated Circuit (PMIC) Controls Engineer (Technical Lead)
Red Cell Partners
/
Finance · Venture Capital · Growth Stage
61 applicants
2 weeks ago
Senior Radio Frequency Test & Integration Engineer, Electronic Warfare
Anduril Industries
/
National Defense · Artificial Intelligence (AI) · Late Stage
Less than 25 applicants
No H1B
2 weeks ago
Lead Package Assembly Integration Engineer (Laser Modules)
Lightmatter
/
Artificial Intelligence (AI) · Semiconductor · Late Stage
86 applicants
2 weeks ago
Senior Staff Engineer - Advanced Packaging & Microfluidic Integration
PacBio
/
Biotechnology · Chemical & Materials · Public
66 applicants
No H1B
3 weeks ago
Principal Quantum Engineer - Application-specific Integrated Circuit (ASIC) Design Lead
Microsoft
/
Artificial Intelligence (AI) · Enterprise Software · Public
152 applicants
No H1B
1 month ago
Radio Frequency Engineer Intern
Intuitive Machines
/
Aerospace · Transportation · Public
100 applicants
1 week ago
Senior Principal Analog Power Management Integrated Circuit (PMIC) Controls Engineer (Technical Lead)
Claros
/
Computer Hardware · Early Stage
Less than 25 applicants
2 months ago
Advanced Systems Engineer - SWIS Integrated Product Team Lead
General Dynamics Mission Systems
/
National Defense · Enterprise Software · Late Stage
Less than 25 applicants
No H1B
1 week ago
Engineer 3, Integrated Circuit Package Design
EdPlus at Arizona State University
/
Education · Higher Education · Late Stage
36 applicants
No H1B
2 months ago
Advanced Systems Engineer - SWIS Integrated Product Team Lead
General Dynamics
/
National Defense · Aerospace · Public
Less than 25 applicants
No H1B
1 week ago
Radio Frequency Integration Engineer II (EWS106)
Research Innovations Incorporated
/
Artificial Intelligence (AI) · Cloud Computing · Growth Stage
86 applicants
No H1B
3 weeks ago
Chip Package Signal and Power Integrity Lead Engineer
Google
/
Software · Computer Software · Public
40 applicants
1 week ago
Engineer 3, Integrated Circuit Package Design
ASU Gammage
/
Art & Creative · Media and Entertainment · Growth Stage
97 applicants
No H1B
5 days agoBe an early applicant
Principal Quantum Engineer - Application-specific Integrated Circuit (ASIC) Design Lead
Microsoft
/
Artificial Intelligence (AI) · Enterprise Software · Public
Less than 25 applicants
No H1B
1 month ago
Radio Frequency Engineer Intern
Intuitive Machines
/
Aerospace · Transportation · Public
143 applicants
4 hours agoBe an early applicant
Packaging Engineer - Inductor and Power Module
Texas Instruments
/
Semiconductor · Electronics · Public
Less than 25 applicants
3 hours agoBe an early applicant
Engineer Aeronautical - Level 4 : Electronics Packaging - R10222485-2
Northrop Grumman
/
Aerospace · Big Data · Public
Less than 25 applicants
No H1B