Principal Engineer Packaging in united states (1000+)
1 day ago
2.5D Principal Packaging Development Engineer
Qualcomm
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Semiconductors · Public
San Diego, CA
Full-time
$202K/yr - $302K/yr
Onsite
Senior Level, Lead/Staff
6+ years exp163 applicants
Comp. & BenefitsH1B Sponsor Likely
2 days ago
Principal Packaging Equipment Engineer
Pharmavite
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Consumer Goods · Late Stage
Los Angeles, CAFull-time$100K/yr - $166K/yrOnsiteSenior Level, Lead/Staff7+ years exp96 applicants
Growth OpportunitiesNo H1B
5 days agoBe an early applicant
Associate Principal Packaging Engineer
Alexion Pharmaceuticals, Inc.
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Public
Durham, North Carolina, United States of AmericaFull-timeHybridSenior Level, Lead/Staff7+ years expLess than 25 applicants
Comp. & BenefitsH1B Sponsor Likely
1 week ago
Sr. Principal Engineer, Advanced Packaging
Marvell Technology
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Semiconductors · Public
Westlake Village, CAFull-time$171K/yr - $253K/yrOnsiteSenior Level, Lead/Staff10+ years expLess than 25 applicants
Growth OpportunitiesNo H1B
2 weeks ago
Associate R&D Principal Packaging Engineer - Pet - Golden Valley, MN
General Mills
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Consumer Goods · Public
Golden Valley, MNFull-time$109K/yr - $164K/yrOnsiteSenior Level, Lead/Staff7+ years exp56 applicants
No H1B
1 month ago
Principal Packaging Engineer- Drug Product Design & Development
Pfizer
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Pharmaceuticals · Public
United States - Missouri - St. Louis - ChesterfieldFull-time$103K/yr - $172K/yrOnsiteSenior Level, Lead/Staff8+ years expLess than 25 applicants
No H1B
1 week ago
Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
SpaceX
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Aviation & Aerospace · Late Stage
Bastrop, TXFull-timeOnsiteLead/Staff15+ years exp69 applicants
Growth OpportunitiesNo H1B
1 month ago
Principal Packaging Engineer
Medtronic
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Medical Device · Public
Memphis, Tennessee, United States of AmericaFull-time$121K/yr - $181K/yrOnsiteSenior Level, Lead/Staff5+ years exp40 applicants
H1B Sponsor Likely
2 months ago
Principal Engineer - Silicon Packaging Architect
Intel Corporation
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Late Stage
US, Arizona, PhoenixFull-time$215K/yr - $303K/yrHybridLead/Staff10+ years exp75 applicants
Growth OpportunitiesH1B Sponsor Likely
3 days ago
Principal Engineer, DP Packaging Equipment
Moderna
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Public
Norwood, MAFull-time$138K/yr - $248K/yrOnsiteSenior Level, Lead/Staff12+ years exp64 applicants
Comp. & BenefitsNo H1B
2 months ago
Principal Packaging & Device Assembly Engineer
INCOG BioPharma Services
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Biotechnology · Growth Stage
Fishers, IndianaFull-timeOnsiteSenior Level, Lead/Staff3+ years expLess than 25 applicants
1 week ago
Principal Packaging Engineer
PDI
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Medical Device · Late Stage
Woodcliff Lake, NJFull-time$128K/yr - $141K/yrOnsiteLead/Staff8+ years exp64 applicants
H1B Sponsor Likely
2 months ago
Principal Optoelectronic Packaging Engineer
Samtec Inc
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Electrical & Electronic Manufacturing · Late Stage
San Diego, CAFull-time$187K/yr - $212K/yrOnsiteLead/Staff15+ years expLess than 25 applicants
H1B Sponsor Likely
3 weeks ago
Sr. Principal, Packaging Engineering
Loyal
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Growth Stage
United StatesFull-time$180K/yr - $240K/yrRemoteSenior Level, Lead/Staff10+ years exp56 applicants
Comp. & Benefits
4 months ago
Principal Engineer - Packaging
Microchip Technology Inc.
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Semiconductors · Public
CA - San Jose - 3850 N. First StFull-time$70K/yr - $163K/yrOnsiteSenior Level, Lead/Staff10+ years expLess than 25 applicants
Work & Life BalanceH1B Sponsor Likely
1 week ago
Principal Engineer, Packaging Engineering
Sandisk
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Semiconductors · Public
Milpitas, CAFull-timeOnsiteSenior Level, Lead/Staff5+ years exp28 applicants
H1B Sponsor Likely
5 days ago
Associate Principal Packaging Engineer
AstraZeneca
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Public
US - Durham - NCFull-timeHybridSenior Level, Lead/Staff7+ years exp39 applicants
Comp. & BenefitsH1B Sponsor Likely
1 week ago
Principal Silicon Photonics Packaging Engineer
Coherent Corp.
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Late Stage
Fremont, CAFull-time$114K/yr - $223K/yrOnsiteSenior Level, Lead/Staff4+ years expLess than 25 applicants
H1B Sponsor Likely
2 weeks ago
Principal Packaging Layout Engineer
Arm
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Semiconductors · Public
Chandler, AZFull-time$241K/yr - $326K/yrHybridLead/Staff10+ years expLess than 25 applicants
Growth OpportunitiesH1B Sponsor Likely
2 weeks ago
Principal Design Engineer, TSV Packaging
Micron Technology
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Semiconductors · Public
Boise, IDFull-timeOnsiteLead/Staff8+ years exp39 applicants
H1B Sponsor Likely