Principal Ic Packaging Engineer in united states (1000+)
1 month ago
Principal Quantum Engineer - Application-specific Integrated Circuit (ASIC) Design Lead
Microsoft
/
Artificial Intelligence (AI) · Enterprise Software · Public
152 applicants
No H1B
2 weeks ago
Principal Quantum Engineer - Application-specific Integrated Circuit (ASIC) Design Lead
Microsoft
/
Artificial Intelligence (AI) · Enterprise Software · Public
Less than 25 applicants
No H1B
1 week ago
Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
SpaceX
/
Aerospace · Manufacturing · Late Stage
99 applicants
No H1B
3 weeks ago
Engineer 3, Integrated Circuit Package Design
ASU Gammage
/
Art & Creative · Media and Entertainment · Growth Stage
97 applicants
No H1B
2 weeks ago
Senior Principal Analog Power Management Integrated Circuit (PMIC) Controls Engineer (Technical Lead)
Red Cell Partners
/
Finance · Venture Capital · Growth Stage
61 applicants
3 weeks ago
Engineer 3, Integrated Circuit Package Design
EdPlus at Arizona State University
/
Education · Higher Education · Late Stage
36 applicants
No H1B
2 weeks ago
Package Development, Signal Integrity and Power Integrity Engineer, Senior Principal
Marvell Technology
/
Telecom & Communications · Semiconductor · Public
Less than 25 applicants
10 hours ago
Application Specific Integrated Circuit Design Engineer
Mirafra Technologies
/
Semiconductor · Software · Late Stage
200+ applicants
2 hours agoBe an early applicant
Senior Principal Manufacturing Engineer - Full Product Line Development
Verterra Energy
/
Energy · Manufacturing · Early Stage
Less than 25 applicants
3 hours agoBe an early applicant
Principal Physical Design Engineer
Astera Labs
/
Artificial Intelligence (AI) · Semiconductor · Public
Less than 25 applicants
6 hours agoBe an early applicant
SMT Principal Engineer
Jabil
/
Electronics · Hardware · Public
Less than 25 applicants
6 hours ago
Packaging Equipment Engineer
kdc/one
/
Consumer Goods · Late Stage
57 applicants
7 hours agoBe an early applicant
Packaging Engineer (Process Professional II)
Novo Nordisk
/
Biotechnology · Healthcare · Public
Less than 25 applicants
19 hours ago
Application-Specific Integrated Circuit (ASIC) Engineer Internship – 2026 (US)
Amazon
/
Retail · Artificial Intelligence (AI) · Public
200+ applicants
10 hours agoBe an early applicant
Principal Physical Design Engineer
Hewlett Packard Enterprise
/
Cloud Computing · Enterprise Software · Public
Less than 25 applicants
10 hours agoBe an early applicant
Principal Engineer, SOC Design
Samsung Semiconductor
/
Semiconductor · Late Stage
Less than 25 applicants
11 hours agoBe an early applicant
Packaging Engineer
Net2Source (N2S)
/
Human Resources · Logistics · Late Stage
Less than 25 applicants
11 hours agoBe an early applicant
Principal Engineer
Clearwater Paper Corporation
/
Food and Beverage · Sustainability · Public
Less than 25 applicants
No H1B
11 hours agoBe an early applicant
Principal ASIC Design Engineer
TTM Technologies
/
Electrical & Electronic Manufacturing · Late Stage
Less than 25 applicants
No H1B
11 hours agoBe an early applicant
Senior/Principal TCAD Engineer
The University of Texas at Austin
/
Education · Corporate Training · Late Stage
Less than 25 applicants