Principal Silicon Photonics Packaging Engineer in united states (1000+)
1 day agoBe an early applicant
Principal Silicon Photonics Packaging Engineer
Coherent Corp.
/
Semiconductors · Public
Less than 25 applicants
1 month ago
Principal Engineer - Silicon Packaging Architect
Intel Corporation
/
Late Stage
40 applicants
5 days ago
Principal IC Packaging Test Engineer, Silicon Technology (Starlink)
SpaceX
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Aviation & Aerospace · Late Stage
69 applicants
No H1B
1 month ago
Silicon Photonic Packaging & Process Engineer
Voyant Photonics
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Industrial Automation · Early Stage
42 applicants
6 days ago
Silicon Photonics Packaging Engineer Co-op
Nokia
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Telecommunications · Public
36 applicants
3 weeks ago
Principal Silicon Photonics Integration Engineer
GlobalFoundries
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Semiconductors · Public
89 applicants
4 weeks ago
Silicon Photonics Packaging Engineer Co-op
Nokia
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Telecommunications · Public
55 applicants
4 weeks ago
Silicon Photonics Packaging Engineer Co-op
Nokia
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Telecommunications · Public
Less than 25 applicants
13 hours ago
Photonics Packaging Engineer II
Jabil
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Electrical & Electronic Manufacturing · Public
46 applicants
2 hours ago
Senior Silicon Application Engineer (Packaging Design)
Intel Corporation
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Late Stage
67 applicants
No H1B
6 hours ago
Principal Engineer Packaging Development R2
Labelmaster
/
Transportation/Trucking/Railroad · Growth Stage
85 applicants
5 hours agoBe an early applicant
Senior Silicon Application Engineer (Packaging Design)
Intel Corporation
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Late Stage
Less than 25 applicants
No H1B
11 hours agoBe an early applicant
Semiconductor Equipment Technician
Raxium
/
Semiconductors · Growth Stage
Less than 25 applicants
21 hours ago
IC Packaging Integration Engineer
AMD
/
Semiconductors · Public
200+ applicants
No H1B
17 hours agoBe an early applicant
Head of Silicon Package Reliability
Google
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Computer Software · Public
Less than 25 applicants
22 hours agoBe an early applicant
Senior Photolithography Process Engineer
Micron Technology
/
Semiconductors · Public
Less than 25 applicants
18 hours agoBe an early applicant
Sr. Packaging Engineer
Mars
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Food Production · Late Stage
Less than 25 applicants
No H1B
18 hours ago
Intern I - Packaging Engineering
Dexcom
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Medical Device · Public
113 applicants
18 hours ago
Semiconductor Process Development Engineer
Raytheon
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Defense & Space · Late Stage
49 applicants
No H1B
19 hours ago
Silicon Engineering Intern
Microsoft
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Computer Software · Public
148 applicants