3dic Packaging Si Pi Applications Engineer in united states (1000+)
3 months ago
3DIC Packaging SI/PI Applications Engineer
Siemens EDA (Siemens Digital Industries Software)
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Late Stage
Austin, TX
Full-time
$143K/yr - $286K/yr
Hybrid
Entry, Mid Level
2+ years expLess than 25 applicants
No H1B
1 day ago
Engineering Manager - Packaging Integration
The Haskell Company
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Construction · Late Stage
Frisco, TXFull-time$125K/yr - $210K/yrOnsiteSenior Level, Lead/Staff10+ years exp47 applicants
H1B Sponsor Likely
1 day agoBe an early applicant
Senior Silicon Application Engineer (Packaging Design)
Intel Corporation
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Late Stage
US, California, Santa ClaraFull-time$164K/yr - $312K/yrHybridSenior Level7+ years expLess than 25 applicants
Growth OpportunitiesNo H1B
2 days agoBe an early applicant
Application Specific Integrated Circuit Design Engineer
Dexian
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Information Technology & Services · Late Stage
Sunnyvale, CAContract$100/hr - $125/hrHybridSenior Level, Lead/Staff10+ years expLess than 25 applicants
H1B Sponsor Likely
2 days agoBe an early applicant
Applications Integration Engineer (Information Systems Specialist 6)
State of Oregon
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Government Administration · Late Stage
Salem, ORFull-time$6,031/mo - $9,133/moHybridSenior Level5+ years expLess than 25 applicants
No H1B
2 days ago
Intern I - Packaging Engineering
Dexcom
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Medical Device · Public
San Diego, CAInternship$27/hr - $29/hrHybridIntern
Start in 2026 Summer119 applicants
H1B Sponsor Likely
2 days agoBe an early applicant
System Application Engineering Intern
Danfoss
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Mechanical Or Industrial Engineering · Late Stage
Ames, IAInternshipOnsiteInternLess than 25 applicants
H1B Sponsor Likely
2 days ago
IC Packaging Integration Engineer
AMD
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Semiconductors · Public
Austin, TXFull-time$118K/yr - $177K/yrOnsiteMid, Senior Level200+ applicants
Growth OpportunitiesNo H1B
2 days ago
Sales Applications Engineer - Battery Pack Systems
Re:Build Manufacturing
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Industrial Automation · Late Stage
New Kensington, PAFull-timeOnsiteMid Level3+ years exp37 applicants
3 months ago
Advanced Packaging SI/PI Staff Engineer
Marvell Technology
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Semiconductors · Public
Westborough, MAFull-time$107K/yr - $158K/yrOnsiteSenior Level, Lead/Staff2+ years expLess than 25 applicants
Growth OpportunitiesH1B Sponsor Likely
1 week ago
Senior/Returnship, Signal Integrity (SI) and Power Integrity (PI) - Principal Applications Engineer
Cadence
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Computer Software · Public
San Jose, CAFull-timeOnsiteSenior Level, Lead/Staff5+ years exp57 applicants
Growth OpportunitiesH1B Sponsor Likely
1 week ago
Package & SI/PI - Hardware Board Designer/PCB Design Engineer
Eliyan Corporation
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Semiconductors · Growth Stage
Bay AreaFull-timeOnsiteSenior Level5+ years exp56 applicants
H1B Sponsor Likely
3 weeks ago
Battery Pack System Architect Engineer
Enovix Corporation
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Electrical & Electronic Manufacturing · Public
Fremont CA, USFull-time$170K/yr - $254K/yrOnsiteSenior Level, Lead/Staff8+ years expLess than 25 applicants
H1B Sponsor Likely
1 month ago
Packaging Application Engineer
Belmark inc
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Printing · Late Stage
De Pere, WIFull-timeOnsiteEntry Level5+ years expLess than 25 applicants
No H1B
3 months ago
Senior Electrical Engineer - Advanced Semiconductor Packaging and Integration
ALTEN
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Information Technology & Services · Public
Santa Clara, CAFull-timeOnsiteSenior LevelLess than 25 applicants
H1B Sponsor Likely
4 weeks ago
Intern, System Validation, Co-Packaged Optics
Ayar Labs
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Computer Hardware · Late Stage
San Jose, CAInternship$44/hr - $55/hrOnsiteInternStart in 2026 Spring49 applicants
No H1B
1 month ago
Packaging Engineer Intern
Minerals Technologies Inc.
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Consumer Goods · Public
US-IL-Hoffman EstatesInternshipOnsiteIntern94 applicants
H1B Sponsor Likely
1 week ago
Application Packaging Engineer
Aspen Technology
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Computer Software · Public
Bedford, MAFull-time$90K/yr - $113K/yrOnsiteEntry Level1+ years exp33 applicants
H1B Sponsor Likely
2 weeks ago
Application-Specific Integrated Circuit (ASIC) Engineer Internship – 2026 (US)
Amazon
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Computer Software · Public
Seattle, WAInternship$50/hr - $88.94/hrOnsiteInternStart in 2026200+ applicants
H1B Sponsor Likely
3 months ago
Lead Cell Integration and Pack Engineer
QuantumScape
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Mechanical Or Industrial Engineering · Public
CA, US, 95131Full-time$185K/yr - $259K/yrOnsiteLead/Staff12+ years exp98 applicants
H1B Sponsor Likely