Engineer Ii Chip And Flowcell Assembly And Packaging in united states (1000+)
9 hours agoBe an early applicant
Engineer II - Chip & Flowcell Assembly and Packaging
PacBio
/
Biotechnology · Chemical · Public
Less than 25 applicants
No H1B
3 hours agoBe an early applicant
Machining Cell Operator 1, 2nd shift ( Online)
RTX
/
Aerospace · Manufacturing · Public
Less than 25 applicants
No H1B
8 hours agoBe an early applicant
FABRICATION ASSEMBLY (FV)
ArmorWorks Enterprises, Inc
/
Manufacturing · Security · Growth Stage
Less than 25 applicants
10 hours ago
Principal Optical Packaging Engineer
Credo
/
Big Data · Information Technology · Public
57 applicants
12 hours ago
Wafer Fab Process Engineer II
SRI
/
Advanced Materials · Artificial Intelligence (AI) · Late Stage
37 applicants
No H1B
10 hours ago
Thinfilm Process Engineering Technician
X-FAB
/
Automotive · Electronic Design Automation (EDA) · Public
44 applicants
10 hours ago
Machining Cell Operator 1, 2nd shift ( Onsite)
Pratt & Whitney
/
Aviation & Aerospace · Late Stage
129 applicants
No H1B
13 hours agoBe an early applicant
Optical Packaging Engineer
Nokia
/
Electronics · Enterprise Software · Public
Less than 25 applicants
19 hours agoBe an early applicant
Manufacturing Engineer, PCBA
Castelion
/
Aerospace · Government · Growth Stage
Less than 25 applicants
No H1B
20 hours agoBe an early applicant
Wafer Process Engineer - 2nd shift
Raytheon
/
Intellectual Property · Internet · Late Stage
Less than 25 applicants
No H1B
17 hours ago
Assembly Process Engineer - Contract
Commonwealth Fusion Systems
/
Clean Energy · Electrical Distribution · Late Stage
96 applicants
20 hours ago
Technical Assembly Lead, Shift 2
AST SpaceMobile
/
Information Technology · Satellite Communication · Public
95 applicants
15 hours ago
Senior Staff Engineer - Advanced Packaging & Microfluidic Integration
PacBio
/
Biotechnology · Chemical · Public
66 applicants
No H1B
20 hours agoBe an early applicant
Engineer Packaging - R10219474
Northrop Grumman
/
Aerospace · Data Integration · Public
Less than 25 applicants
No H1B
22 hours ago
Staff Engineer, Packaging Engineering (New College Graduate)
Sandisk
/
Data Storage · Manufacturing · Public
66 applicants
23 hours ago
Principal, Process Engineer - Biologics
Barry-Wehmiller
/
Machinery · Late Stage
75 applicants
1 day ago
Wafer Fab Process Engineer
Teledyne Technologies Incorporated
/
Electronics · Energy · Public
200+ applicants
No H1B
1 day agoBe an early applicant
E-beam Operation (EBO) Manufacturing Engineer
TSMC
/
Consumer Electronics · Electronics · Public
Less than 25 applicants
1 day ago
Manufacturing Engineer (Teradyne, N. Reading MA)
Teradyne
/
Consumer Electronics · Industrial · Public
167 applicants
No H1B
1 day ago
Senior Photolithography Engineer-Nanofabrication
Harvard University
/
Education · Higher Education · Late Stage
104 applicants
No H1B