Booz Allen Hamilton · 3 days ago
Application Specific Integrated Circuit Microelectronics Engineer
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Responsibilities
Serve as a strategic technical consultant to DARPA for overseeing the creation and execution of advanced government-funded research programs in ASIC microelectronics.
Impact national security investments through the development of cutting-edge technologies.
Provide strategic assessments of new technologies to senior DoD decision-makers.
Produce and present findings and recommendations to colleagues and clients on the feasibility and potential impact of future research programs.
Assist with the management of programs and facilitate the transition of program deliverables to DoD stakeholders.
Qualification
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Required
2+ years of experience with analog, digital, or mixed-signal integrated circuit design, including in industrial or academic environments
Experience in ASIC physical design, simulation, and verification, including layout through tape-out and board-level testing
Ability to travel up to 15% of the time
Ability to obtain a security clearance
Master's degree in Electrical Engineering, Electronics Engineering, or Computer Engineering
Preferred
Experience with academic research in novel analog, digital, or mixed-signal integrated circuit topologies
Experience with DoD research and development projects
Experience with authoring technical papers and reports for technical and non-technical audiences
Experience with technical project or program management
Experience in a client-facing or consulting work environment
Doctorate degree in Electrical Engineering, Electronics Engineering, or Computer Engineering
Benefits
Health Savings Account (HSA) contributions
Paid holidays
Paid parental leave
Flexible schedules
Remote and hybrid work options
Company
Booz Allen Hamilton
Booz Allen Hamilton is a consulting firm that specializes in analytics, technology, and engineering.
H1B Sponsorship
Booz Allen Hamilton has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (14)
2022 (31)
2021 (29)
2020 (38)
Funding
Current Stage
Public CompanyTotal Funding
$2.38B2023-08-01Post Ipo Debt· $650M
2020-08-13Post Ipo Debt· $700M
2015-02-02Post Ipo Secondary· $340.32M
Leadership Team
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