Applied Materials · 4 days ago
Packaging Engineer
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ElectronicsManufacturing
Insider Connection @Applied Materials
Responsibilities
Drive new materials and process development to enable 3D NAND pitch scaling through structured problem-solving methodology.
Define and develop differentiated modules for W2W hybrid bonding by leveraging Applied Materials' broad portfolio of tools.
Lead projects across the organization and culture in a fast-paced environment.
Qualification
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Required
Domain expertise in W2W hybrid and fusion bonding with deep understanding of materials, process device physics and integration
Ability to drive new materials and process development to enable 3D NAND pitch scaling through structured problem solving methodology
Proven track record of solving complex problems by working effectively with cross-functional teams across different business units
Ability to define and develop differentiated modules for W2W hybrid bonding by leveraging Applied Materials broad portfolio of tools
Thought leader to define and maintain Applied Materials roadmap in hybrid and fusion bonding for emerging memory architectures
Minimum of BS/MS in Electrical, Mechanical Engineering, Material Engineering or equivalent
5 years of experience in W2W bonding specializing in 3D NAND (preferred) or CIS
Strong communication skills to be effective in dealing with Business Units, cross-functional teams, internal or external manufacturing and customer
Lead project across organization and culture in a fast-paced environment
Self-starter, team player and able to work independently with minimal supervision
Preferred
Experience with MES systems for 300mm Si processing is preferred
Benefits
Comprehensive benefits package
Bonus program
Stock award program
Company
Applied Materials
Applied Materials is a semiconductor and display equipment company that offers materials engineering solutions.
H1B Sponsorship
Applied Materials has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (280)
2022 (405)
2021 (478)
2020 (378)
Funding
Current Stage
Public CompanyTotal Funding
$101.53MKey Investors
Stonnington GroupUS Department of Energy
2023-06-27Post Ipo Equity· $0.38M
2022-10-19Grant· $100M
2013-09-09Grant· $1.15M
Leadership Team
Recent News
SeekingAlpha
2024-06-05
2024-06-01
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