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Company

Original Job Post

Qorvo, Inc. · 4 days ago

Senior Product Package Engineer

Greensboro, NC

Full-time

Onsite

Senior Level

7+ years exp

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Responsibilities

Provide best in class industry “know-how” to enable continued global leadership of Qorvo packaging solutions.

Utilize program management methodology to plan, execute and monitor complex process and/or product development projects.

Facilitate or lead cross-functional technical teams through New Product Introduction (NPI) and/or problem-solving.

Design for manufacturability and cost to ensure smooth transition to High Volume Manufacturing.

Develop and deploy advanced design rules into next-generation products.

Work in collaboration with technology and business units to deploy next-generation packaging solutions incorporating GaN, Si, and GaAs semiconductor devices into products.

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Semiconductor PackagingPackaging TechnologiesRF ModulesHigh PowerHigh Frequency PackagesAssemblyFan-OutWafer Level PackagingSMTDie AttachWire BondFlip ChipMoldingInterconnectLaminateDesign for ManufacturabilityHigh Volume ManufacturingNew Product DevelopmentTechnology InnovationSPC TechniquesDOEStructured Problem-SolvingDMAIC8DProgram Management Methodology

Required

7-10 years’ direct experience in semiconductor packaging.

BS, or higher in Engineering or Material science.

Preferred

Thorough industry knowledge and experience of packaging technologies.

Strong background in process / packaging technologies preferably with direct experience in either RF Modules or high power and high frequency packages.

Knowledgeable across a wide range of assembly, packaging, processes technologies and materials e.g, fan-out, wafer level packaging, SMT, Die Attach, Wire Bond / Flip Chip, Molding, interconnect, laminate, etc.

Strong understanding of Design for Manufacturability and requirements needed to ramp these technologies in a high volume manufacturing environment

Proven track record of supporting New Product and/or Technology through innovative packaging solutions.

Ability to utilize SPC techniques, DOE, and structured problem-solving methodologies (e.g. DMAIC, 8D).

Experience with Program Management Methodology

Company

Qorvo, Inc.

Glassdoor

3.7

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.

Founded in 2015

Greensboro, North Carolina, USA

5,001-10,000 employees

https://www.qorvo.com/

H1B Sponsorship

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2023 (39)

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2020 (67)