59 applicants

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Company

Original Job Post

NVIDIA · 2 days ago

Senior Packaging Technical Engineer

California, United States

Full-time

Remote

Senior Level

$156K/yr - $299K/yr

8+ years exp

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Artificial Intelligence (AI)GPU

H1B Sponsorship

Growth Opportunities

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Responsibilities

Define the chip pad ring, substrate interconnect scheme, and lead the package layout design process.

Collaborate with large teams consisting of Circuit, Signal Integrity, RTL, Place and Route, substrate layout and system design Engineers and Managers.

Work to define a chip floor plan, pad ring, substrate, and ball out implementing a robust world-class electrical package.

Communicate effectively with various teams throughout the company.

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

BSEEBoard/System DesignTransmission Line TheoryPower DeliverySignal IntegrityProgrammingScriptingPerlPythonTclProblem-SolvingEnthusiasticPackage DesignCadence SkillExcel

Required

BSEE or equivalent experience

Minimum of 8+ years in board/system design

Good understanding of transmission line theory, power delivery and signal integrity

Strong programming and scripting skills in Perl, Python, Tcl desired

Enthusiastic and able to work with a minimum of supervision

You seek to solve complex technical problems

Preferred

Experience with package design

Cadence Skill and EXCEL familiarity are helpful

Benefits

Equity

Benefits

Company

NVIDIA

Glassdoor

4.6

NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.

Founded in 1993

Santa Clara, California, USA

10,001+ employees

https://www.nvidia.com

H1B Sponsorship

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Trends of Total Sponsorships

2023 (735)

2022 (892)

2021 (696)

2020 (534)