133 applicants

Company

Original Job Post

NVIDIA · 2 days ago

Senior Package Design Engineer

Santa Clara, CA

Full-time

Onsite

Senior Level

$136K/yr - $264K/yr

6+ years exp

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Artificial Intelligence (AI)GPU

H1B Sponsorship

Growth Opportunities

Hiring Manager

Sarmita Chatterjee

Insider Connection @NVIDIA

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Responsibilities

Define the chip pad ring, substrate interconnect scheme, and lead the package layout design process for package test vehicles

Focus primarily on flip chip and 2.5D interposer based packages

Implement electrical/mechanical/thermal structures in test vehicles for effective package technology evaluations

Develop design flow for new package technologies

Collaborate with cross functional teams to incorporate various requirements in package designs

Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules

Qualification

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Package DesignProgramming PerlProgramming PythonProgramming TclCadence Allegro Packaging Design2.5D PackagesProblem Solving

Required

BS in EE or ME (or equivalent experience)

6+ years package design experience

Strong programming skills (Perl, Python, Tcl desired)

Working knowledge of Cadence Allegro Packaging Design (APD)

Experience in 2.5D packages

Strong problem solving skills

Benefits

Equity

Company

NVIDIA

Glassdoor

4.6

NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.

Founded in 1993

Santa Clara, California, USA

10,001+ employees

https://www.nvidia.com

H1B Sponsorship

NVIDIA has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Trends of Total Sponsorships

2023 (735)

2022 (892)

2021 (696)

2020 (534)