Oculus VR · 1 week ago

Process (Integration) Engineer

Redmond, WA

Full-time

Onsite

Mid Level

2+ years exp

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Responsibilities

Innovate processes for fabrication of novel devices and advanced packaging solutions for flexible/stretchable integration of electronic components, devices, and systems

Design experiments for development, evaluation, and yield enhancement of processes to develop Best Known Methods (BKMs) that will be leveraged for prototype development

Partner and collaborate with researchers, hardware engineers, device and systems integration teams, and external partners to push development beyond state-of-the-art

Design, execute, and oversee internal, external, and hybrid manufacturing integration workflows to mature, document, track process stability, and deliver research prototypes

Contribute new technologies and methods innovation to close critical capability gaps

Qualification

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Process EngineeringMicrofabricationNanofabricationMEMSAdvanced PackagingWet EtchDry EtchChemical Vapor DepositionPhysical Vapor DepositionElectrochemical DepositionPhotolithographyMetrologyBack-end-of-lineSurface Mount TechnologyLaser MachiningMicro-moldingProcess DevelopmentFabricationCharacterizationElectrical Schematic DesignPhysical LayoutsMechanical DesignHigh Performance Electronic MaterialsMaterials ScienceElectrical EngineeringMechanical EngineeringChemical EngineeringApplied PhysicsAerospace EngineeringElectronic Design Automation (EDA)

Required

B.S. or equivalent degree or comparable experience in field of Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Applied Physics, Aerospace Engineering, or related field

2+ years experience in process engineering focused on micro- or nanofabrication, MEMS, advanced packaging and/or related technologies to include, but not limited to, wet/dry etch, chemical vapor deposition (CVD), physical vapor deposition (PVD), electrochemical deposition (ECD), photolithography, metrology, back-end-of-line (BEOL), surface mount technology (SMT), laser machining, micro-molding and/or similar fabrication processes

Demonstrated 2+ successful outcomes in process development and fabrication in a development or production environment, including, but not limited to, optimization of a single process, utilization of test and characterization methods and instruments for validation, electrical schematic design, physical layouts, mechanical design, and/or related outcomes

2+ years of experience in development and/or use of high performance electronic materials

Preferred

Advanced degree in field of Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Applied Physics, Aerospace Engineering, or related field

Experience using Electronic Design Automation (EDA) tools in design and subsequent fabrication of advanced packaging technologies including flexible printed circuits (FPC), printed circuit board (PCB) and/or redistribution layers (RDL), wafer-level packaging (WLP), system-in-package (SiP), flexible hybrid electronics (FHE) or similar technology

Either depth of expertise in a specific fabrication technology area or experience in process integration that leverages a breadth of process experience from front-end to BEOL with a demonstrated record of leveraging expertise to build devices, circuits, and/or systems

Working experience with metrology equipment and processes, to include but not limited to, scanning electron microscopy (SEM), focused ion beam (FIB) cross-section, ellipsometry/reflectometry, automated optical inspection (AOI), atomic force microscopy (AFM), confocal & optical microscopy/inspection, contact and non-contact profilometry, scanning acoustic microscopy (SAM), or similar techniques

Practical experience in substrate bonding and debonding, hermetic sealing, MEMS packaging, compression molding, transfer molding, planarization, or similar technologies