PA Design Engineer @ Qorvo, Inc. | Jobright.ai
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Qorvo, Inc. · 5 days ago

PA Design Engineer

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Hiring Manager
Scott Mitchell
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Responsibilities

Responsible for module level design and integration of PAs, LNAs, switches and filters into highly compact multi-chip modules (MCM)
Thorough understanding of ADS and em tools such as HFSS and Momentum and how they apply to laminate based modules
Conducting peer reviews of designs, including expected and/or actual results
Writing regular updates on design/evaluation status
Committed engineer able to execute to an aggressive schedule

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

RFIC designTransistor-level knowledgeCircuit design techniquesMeasurement techniquesEM simulatorsCircuit simulationLayoutTape-outIII-V HBTIII-V HEMTSi CMOSSOIBiCMOS technologiesDiscrete power amplifier designThermal managementProblem-solvingAdaptabilityCommunication

Required

Proficiency with Keysight ADS and/or similar simulators for all stages of RFIC design, including Harmonic Balance, S-Parameter, Transient and Envelope Simulation. Detailed transistor-level knowledge of RF and microwave circuit design techniques including linear power amplifier design; high-efficiency power amplifier design, low noise amplifiers, bias circuits, and module design.
Knowledge of test and measurement techniques and equipment for RF circuits, such as signal generators, VNAs, and spectrum/signal analyzers.
Use of EM simulators such as ADS Momentum, ADS FEM, and/or Ansys HFSS in conjunction with circuit simulators to accurately predict overall circuit performance.
Require MS in Electrical Engineering (or foreign equivalent) and up to 3 years' experience in RFIC layout and tape-out, using III-V HBT, III-V HEMT, Si CMOS, SOI, and/or BiCMOS technologies; circuit and EM simulation in Keysight ADS including experience with ADS Momentum, ADS FEM and/or HFSS; discrete power amplifier design for frequencies of 1-5GHz; measurement of designed circuits after tapeout; knowledge of test and measurement techniques for RF circuits; and use of signal generators, vector network analyzers, and spectrum/signal analyzers.
Understanding of thermal management in power amplifiers
Ability to work in a fast-paced, highly motivated and very interactive team environment
Adapt to new customer requirements for ruggedness, ESD, and quality
Strong written and verbal communication skills to convey complex technical information

Company

Qorvo, Inc.

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Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.

H1B Sponsorship

Qorvo, Inc. has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (39)
2022 (78)
2021 (98)
2020 (67)

Funding

Current Stage
Public Company
Total Funding
$350M
2019-09-30Post Ipo Debt· $350M
2015-01-09IPO· nasdaq:QRVO

Leadership Team

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Robert Bruggeworth
CEO
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Mark Murphy
CFO
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Company data provided by crunchbase
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