Senior Engineer, Assembly Engineering @ Analog Devices | Jobright.ai
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Senior Engineer, Assembly Engineering jobs in San Jose, CAH1B Visa Sponsored Senior Engineer, Assembly Engineering jobs in San Jose, CA
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Analog Devices · 1 week ago

Senior Engineer, Assembly Engineering

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DSPElectronics
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H1B Sponsorship
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Actively Hiring

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Responsibilities

Power module development: design, simulate, optimize, and qualify power module products.
Business Unit (BU) communications: understand package requirements and influence package-related design decisions.
Assembly subcontractor/OSATs communications: collaborate with oversea assembly subcontractors for package development.
Cross functional team collaborations: work with reliability team, business units, and supply chain management for package-related support.
Project management: plan and drive on-time delivery of development projects.
Package bill of material (BOM) selection: understand mechanical, thermal, and electrical properties of materials.
Package model and drawing creation: use CAD tools to create package design models and drawings.
Package process development: experience in manufacturing control plan, process failure mode and effects analysis (FMEA), statistical process control (SPC), and design of experiment (DOE).

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Power ElectronicsElectrical EngineeringMaterials SciencePower Module DesignOptimizationManufacturingInductor DesignConstructionMaterial SelectionElectrical Simulation ToolsAnsys Q3DAnsys MaxwellIC Package ReliabilityFailure Analysis TechniquesAssembly Process IssuesManufacturing Control PlanFMEAPCNSPCDOE

Required

Master’s degree in Materials Science and Engineering, Applied Physics, or Electrical Engineering is required with 1-5 years of industrial working experience in related fields. PhD. degree is preferred.
Strong background in power electronics, electrical engineering, and materials science.
In-depth knowledge and experience in power module design, optimization, and manufacturing.
Experienced in inductor design, construction, and material selection.
Experienced in electrical simulation tools, such as, Ansys Q3D and Ansys Maxwell.
Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.

Preferred

PhD. degree in Materials Science and Engineering, Applied Physics, or Electrical Engineering.
Experience in manufacturing control plan, process failure mode and effects analysis (FMEA), process change notification (PCN), statistical process control (SPC), and design of experiment (DOE).

Benefits

Medical coverage
Vision coverage
Dental coverage
401k
Paid vacation
Paid holidays
Sick time

Company

Analog Devices

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Analog Devices (NYSE: ADI) defines innovation and excellence in signal processing. ADI's analog, mixed-signal, and digital signal

H1B Sponsorship

Analog Devices has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (144)
2022 (156)
2021 (145)
2020 (157)

Funding

Current Stage
Public Company
Total Funding
unknown
2012-04-13IPO· nasdaq:ADI

Leadership Team

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Vincent Roche
Chief Executive Officer and Chair of the Board of Directors
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Alan Lee
Chief Technology Officer
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Company data provided by crunchbase
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