Leidos · 2 days ago
Senior FPGA DSP Firmware Design Engineer
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Responsibilities
Lead a firmware design team to design, integrate and test challenging DSP FPGA designs for EW sensor systems.
Evaluate a project’s firmware needs, design a firmware solution, and communicate the design to program leadership.
Develop and implement new firmware, debug firmware, evaluate performance, and troubleshoot as needed.
Incorporate client feedback into firmware revisions, manage budgetary and time constraints.
Keep the firmware team updated on technological developments and industry best practices.
Lead the design and development of innovative reconfigurable Software-Defined Radio (SDR) architectures, Sensor Systems, Data Acquisition, from Air/Space to Ground deployments for government agencies.
Analyze schematic diagrams for high-speed digital and/or analog circuitry in associated FPGA-centric systems.
Develop and maintain requirements documents, engineering drawings, and configuration management policies for FPGA project hierarchy.
Develop project test plans and test procedures, provide test planning support, and assist in the execution of both lab testing and field testing.
Conduct experimental tests on latest FPGA and SoC evaluation boards, evaluate results, and develop specifications for selecting next-generation components for deliverable systems.
Travel and work at remote sites for limited time periods may be occasionally required.
Provide status reports to project managers and/or division production manager as required.
Qualification
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Required
Active US government Top Secret clearance.
Ability to work full time at facility site in Arlington, VA
Experience with FPGA Integrated Design Environment tool sets such as Xilinx Vivado and Mentor Graphics ModelSim.
Experience with latest System on a Chip (SoC) implementations such as Xilinx Zynq Ultrascale+, Intel Stratix-10, and Xilinx RFSoC.
Proficiency in hardware descriptor languages, HDL (VHDL, Verilog) and/or MATLAB model(s).
Ability to perform design constraints generation and verification as well as evaluate synthesis and timing performance reports.
Hands on design and test experience with signal processing concepts such as FFTs, channelizers, digital filters, digital modulation, digital down/up-conversion, adaptive processing, etc and their implementation into new or existing modular HDL designs.
Familiarity with common signaling standards, typical IP hard macros such as SERDES, PLLS, etc. and/or protocols such PCIe, JESD204B, LVDS, etc.
Proficiency with hardware integration, test and debug tools (high-speed logic analyzers, scopes, spectrum analyzers, etc.)
Bachelors in Electrical Engineering or Computer Engineering or similar field
Minimum of 12 years of relevant experience with at least 2 years in a technical leadership position
Preferred
Experience writing test software in C/C++ or assembly language to validate design
Experience with high-speed (> 20GHz) design techniques
ARM or RISC-V embedded processor based SoC design experience
Proven experience in the military/aerospace hi reliability electronic warfare product development, especially in the area of radiation hardened, space grade FPGA circuit card design
Subject matter expert in high-speed digital hardware, embedded firmware & software, and miniaturized high-performance systems for EW applications.
Expertise in optimum thermal management for FPGA circuit card design for high altitude conduction cooled applications
Ability to obtain TS/SCI clearance
Ability to obtain TS/SCI clearance
Company
Leidos
Leidos is a Fortune 500® innovation company rapidly addressing the world’s most vexing challenges in national security and health.
Funding
Current Stage
Public CompanyTotal Funding
unknown2013-09-17IPO· nyse:LDOS
Leadership Team
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2024-04-12
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