80 applicants

Company

Original Job Post

Vicor Corporation · 5 days ago

Manufacturing Engineer

Andover, MA

Full-time

Onsite

Mid Level

3+ years exp

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Responsibilities

Will work with enabling technologies such automated product assembly and automated fluid dispensing integrated with PCB and SMT technologies.

Develop cost-effective electronics packaging improvements and efforts for new products.

Write technical reports and prepare presentations covering process development activities and next-generation processing methods.

Have hands-on responsibility for equipment including programming and SPC for highest yields and lowest cost.

Implement and manage real-time SPC and utilize Six Sigma tools for meaningful process controls.

Support the organizational goal of Automotive Readiness for IATF 16949 Certification.

Monitor line yield, scrap, and equipment utilization daily.

Work independently and lead cross-functional development teams using DMAIC process.

Monitor line performance and take corrective action to eliminate process problems and improve yields.

Work with Design, Test, and Quality Engineering to implement yield and quality enhancements.

Work with hourly production and maintenance personnel to improve line performance.

Review new product designs for compatibility with process capability and make appropriate recommendations.

Identify and lead cost reduction and quality improvement initiatives.

Initiate and approve manufacturing documentation and ECO’s.

Investigate problems, determine root cause, and implement corrective and preventative actions.

Expected to be hands-on with equipment, including occasional maintenance and troubleshooting.

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Electronics PackagingManufacturingAutomotive RequirementsIATF 16949 CertificationPPAPBIQFTQDesign SoftwareSolid WorksPro EngineerAuto CADAdvanced PackagingProcessing StrategiesSystem in a Package DevicesSIPUniversal PickAsymtek Fluid Dispense ProcessesSix SigmaTechnical Problem SolvingProblem SolvingHard WorkingOrganizational SkillsManufacturing EnvironmentCeramic SubstratesFerritesFlip ChipsBGALead-Free SolderingMSLTransfer Molding

Required

Bachelor's Degree in Mechanical, Chemical, Industrial or Manufacturing Engineering

3+ years’ experience with electronics packaging and/or manufacturing

Experience with Automotive Requirements such as IATF 16949 Certification, PPAP, BIQ, FTQ considered a plus

Experience using design based software systems like Solid Works, Pro Engineer, or Auto CAD

Familiarity with advanced packaging and processing strategies for system in a package devices (SIP)

Knowledge of Universal Pick and Place and Asymtek fluid dispense processes

Good hands-on engineering skills and ability to work on production equipment

Solid skills in problem solving and implementation of Six Sigma

Ability to understand, analyze, and resolve moderately complex technical problems

Ability to work independently and be effective in a fast-paced environment

Excellent writing and organizational skills

Preferred

Master’s degree

Former coop experience in a manufacturing environment

Knowledge of ceramic substrates, ferrites, flip chips, BGA’s, lead-free soldering, MSL, transfer molding and encapsulation, high current interconnects

Ability to work with high layer count laminate (PCB)

Ability to work with cloud servers, autonomous vehicles, military, and industrial equipment

Experience with Six Sigma tools such as PFMEAs

Experience with Universal Pick and Place and Asymtek fluid dispense processes

Company

Vicor Corporation

Glassdoor

3.8

Vicor Corporation designs, manufactures and markets innovative, high performance modular power components, from bricks to

Founded in 1981

Andover, Massachusetts, USA

1,001-5,000 employees

http://www.vicorpower.com

H1B Sponsorship

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