Micron Technology · 3 days ago
SENIOR ENGINEER - CE CAD
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ComputerHardware
Insider Connection @Micron Technology
Responsibilities
Develop tools, flows, and methodologies to increase the productivity and reliability of DRAM designs.
Integrate commercial EDA (Electronic Design Automation) tools into design flows.
Provide training, documentation, and support to end users on new tools and methods.
Work closely with design, layout, verification, and process teams.
Undertake Independent Research and Develop Next-Generation CAD Software to Meet Product Development Needs.
Identify deficiencies of current tools and flows.
Understand EDA industry product offerings and trends, and opportunities for gaining performance and efficiency.
Evaluate tools with internal customers.
Define possible flows for improvement of efficiency and cost.
Develop, maintain, and support the engineering infrastructure.
Maintain all aspects of design infrastructure at an optimum level.
Provide support and training of the design environment.
May telecommute from home part-time.
Qualification
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Required
Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, Applied Computer Science, or related field
4 years of experience in the job offered or in a SENIOR ENGINEER - CE CAD related occupation
Benefits
Medical, Dental, and Vision Plans
Paid Time-Off
Paid Holidays
Paid Family Leave
Income Protection Benefits
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (226)
2022 (602)
2021 (563)
2020 (557)
Funding
Current Stage
Public CompanyTotal Funding
$6.15BKey Investors
U.S. Department of Commerce
2024-04-25Grant· $6.1B
2013-09-01Post Ipo Equity· $16M
2010-01-15IPO· nasdaq:MU
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2024-05-28
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2024-05-27
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2024-05-24
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