Apple · 4 days ago
DRAM Packaging Engineer
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Consumer ElectronicsHardware
H1B SponsorshipComp. & Benefits
Insider Connection @Apple
Responsibilities
Define memory package architectures with advanced package processes to support memory bandwidth and density needs.
Establish memory package plan of record including form factor, technology, process, layout, bill of materials, design rules, thermo-mechanical, signal integrity, and power integrity.
Publish internal package specs for customized memory and establish collaborative relationships with vendors for DRAM memory package development and qualification.
Review, drive, and approve DRAM memory vendors' DOEs/characterization plans, technology, and product qualification data for package development.
About 10% international travel required.
Qualification
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Required
5+ years’ experience in memory package architecture and assembly process development for stacked-die packages
Strong knowledge of advanced packaging technology, design rules, SIPI, to architect high-density packages.
Strong knowledge of packaging materials, substrate technology, and their mechanical and thermal behaviors
Solid working experience in package test and reliability, system-level downstream process interaction and packaging inspection metrology
Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
Strong written and verbal communication skills for working with internal multi-functional teams and OSATs
BS and 10+ years of relevant industry experience.
Benefits
Comprehensive medical and dental coverage
Retirement benefits
Discounted products and free services
Reimbursement for certain educational expenses
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a corporation that designs, manufactures, and markets consumer electronics, personal computers, and software.
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (2569)
2022 (4857)
2021 (4908)
2020 (3580)
Funding
Current Stage
Public CompanyTotal Funding
$1.17BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2021-04-30Post Ipo Equity· Undisclosed
2019-03-25Post Ipo Secondary· $15M
2017-09-06Undisclosed· $5M
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
2024-06-06
Digital Trends
2024-06-06
Digital Trends
2024-06-06
Company data provided by crunchbase