Memory Silicon Characterization and Product Engineer @ Western Digital | Jobright.ai
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Memory Silicon Characterization and Product Engineer jobs in Milpitas, CAH1B Visa Sponsored Memory Silicon Characterization and Product Engineer jobs in Milpitas, CA
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Western Digital · 3 days ago

Memory Silicon Characterization and Product Engineer

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Responsibilities

Define and execute design validation/silicon characterization and Production testing plans for advanced memory chips.
Work closely with supporting teams in design, product development, memory device, and process to ensure readiness for first silicon power-up.
Enable user mode and test mode functionality upon silicon arrival and characterize/debug all user mode and test mode features.
Develop deep knowledge of chip architecture to enable characterization strategy. Drive technical innovation to enhance testing capabilities, including pre-silicon verification and post-silicon validation, tools, script development, technical and procedural methodology enhancement, and cross-functional tasks.
Develop silicon characterization documentation to include all test mode features necessary for productization readiness in wafer sort, burn in testing, HSIO testing etc.
Partner with ATE test development team for test program bring up and validation.
Contribute for Yield Improvement and Test time reduction activity in Production testing.
Provide necessary eFA support to failure analysis labs to root cause failing modes.
Contribute to pre-silicon verification for all test mode features using the design verification environment.
Drive technical efforts necessary to bridge any specification gaps.
Drive tasks independently and efficiently to completion.
Communicate efficiently between design teams, logic, process, product/test engineering, and architecture teams.

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Memory IntegrationEDA ToolsScripting LanguagesData Analysis ToolsLab ToolsATE Memory TestersTesting TechniquesMemory TechnologiesProduction Testing FlowsWafer SortPackage Burn HSIOJEDEC Testing RequirementsIO ProtocolsDDRLPDDRToggle ModeDFT ImplementationSCANMBISTIO Loop Back

Required

Master’s degree (in EE, Physics, or related field) or a minimum 8+ years of practical experience with Post silicon design validation/Silicon Characterization and Product Engineering work mainly in memory testing
Experience with Memory new product integration from initial bring to HVM ramp.
Experience with various EDA tools useful in circuit design and verification i.e., cadence virtuoso, hspice, Spectre
Experience with scripting languages like Perl, Python, R
Experience with various data analysis tools and used to have experience working with JMP.
Experience using lab tools like oscilloscope, parametric analyzer, uProbing station etc
Experience working with ATE memory testers such as Teradyne or Advantest

Preferred

Familiar with testing techniques for various memory technologies such as NAND, NOR, DRAM, or emerging memories.
Familiar with Production testing flows i.e., wafer sort, package burn in and HSIO.
Familiar with JEDEC testing requirements.
Familiar with various IO protocols like DDRx, LPDDRx, Toggle Mode.
Knowledge to various DFT implementation like SCAN, MBIST, IO Loop back is a plus.

Benefits

Paid vacation time
Paid sick leave
Medical/dental/vision insurance
Life, accident and disability insurance
Tax-advantaged flexible spending and health savings accounts
Employee assistance program
Other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity
Tuition reimbursement
Transit
Applause Program
Employee stock purchase plan
Western Digital Savings 401(k) Plan

Company

Western Digital

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Western Digital helps customers capture, preserve, access, and transform an ever-increasing diversity of data.

H1B Sponsorship

Western Digital has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (378)
2022 (559)
2021 (560)
2020 (342)

Funding

Current Stage
Public Company
Total Funding
$901.37M
2023-10-31Post Ipo Debt· $1.37M
2023-01-31Post Ipo Equity· $900M
2015-09-30Post Ipo Equity· Undisclosed

Leadership Team

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David Goeckeler
Chief Executive Officer
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Bob Eulau
Chief Financial Officer
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Company data provided by crunchbase
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