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Company

Original Job Post

Meta · 4 days ago

Silicon Packaging Design Engineer

Menlo Park, CA

Full-time

Onsite

Senior Level

10+ years exp

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Comp. & Benefits

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Responsibilities

Perform package design for advanced custom silicon comprising single-chip/multi-chip and 3D or wafer packaging. This includes: design feasibility studies and analyses, package design/layouts based on silicon chip IO, electrical performance and system ID/form factor requirements

Participate in silicon architecture/package/PCB/system co-design work collaborating with downstream system design teams and upstream silicon designers to develop holistically optimal solutions

Co-work with internal silicon, architecture and system teams and externally engaged partners, ASIC design partners, foundry and OSAT and substrate vendors

Perform design analysis and what-if scenarios for novel packaging schemes such as 2.5D/3D and heterogeneous integration to improve bandwidth, power efficiency and package form factor for next generation versions of current products

Lead package development to establish package manufacturability and reliability

Collaborate with multi-functional teams with in Meta and define package requirements

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Advanced Silicon Packaging DesignCadence AllegroMentor XpeditionSI/PI ToolsPackage Model ExtractionS-ParametersRLGC ModelInterposer DesignFanout Package DesignOrganic InterposerInorganic InterposerBridgesElectrical EngineeringMaterial EngineeringThermal EngineeringMechanical EngineeringEffective CommunicationProduct DevelopmentPrototypingProductionFlip Chip2.5D3DWafer PackagingPackage DesignCAM350CalibreCADHigh-Speed LayoutCrosstalk Mitigation

Required

Bachelor's degree in Computer Science, Computer Engineering, relevant technical field, or equivalent practical experience.

10+ years of experience in advanced silicon packaging design

Experience in advanced package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools.

Basic understanding in one of the SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model.

Hands of experience in interposer or fanout package design for both organic and inorganic interposer with or without bridges

Bachelor's degree in Electrical engineering, Materials Engineering, Computer Engineering, relevant technical field, or equivalent practical experience.

Proven fundamentals in the electrical/material/thermal or mechanical engineering field(s).

Effective communication skills and experience working effectively with cross-functional teams

Preferred

Master’s or PhD degree in Electrical/Materials engineering

Experience and prior experience of taking products from concept to prototyping and production

In-depth knowledge of flip chip, 2.5D and 3D and wafer packaging technologies package design

Familiarity with CAM350/Valor or Calibre and CAD along with experience in package design reviews.

Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance).

Solid understanding of Design Rules Check and Design for Manufacturing.

Company

H1B Sponsorship

Meta has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Trends of Total Sponsorships

2023 (2750)

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2021 (798)