Senior Packaging/Assembly Engineer @ indie Semiconductor | Jobright.ai
JOBSarrow
RecommendedLiked
0
Applied
0
Senior Packaging/Assembly Engineer jobs in Nuremberg, PA
Be an early applicantLess than 25 applicants
company-logo

indie Semiconductor · 3 days ago

Senior Packaging/Assembly Engineer

Wonder how qualified you are to the job?

ftfMaximize your interview chances
AutomotiveSemiconductor
check
Growth Opportunities

Insider Connection @indie Semiconductor

Discover valuable connections within the company who might provide insights and potential referrals, giving your job application an inside edge.

Responsibilities

Define advanced package requirements
Select and qualify advanced package technologies, materials and surface mount processes
IC package design and supervision of assembly process
Support package reliability investigations and failure analysis
Support production ramp-up and process optimization programs
Support the selection, evaluation and co-ordination of subcontractor manufacturing
Experience in guiding and controlling external suppliers
Work with foundry and OSAT to bring packaging solution from concept to HVM
Experience in RF packages fcCSP beneficial

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Packaging TechnologiesAssembly ProcessesIC Packaging MaterialsReliability StandardsFA TechniquesProject ManagementInternational PartnersPackage Design SoftwaresAPDAltium DesignerInterpersonal SkillsBusiness Partnership BuildingCollaborationRF PackagesCST Studio SuiteAnsys HFSSAnsys Q3DAnsys SIwaveCadence Sigirty

Required

Engineering Master’s degree in an electronic or microelectronic field with 5+ years of industrial experience in advanced IC packaging
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Professional experience in project management with international partners
Shown capabilities using package design softwares, APD, Altium Designer, Virtuoso, etc.

Preferred

Knowledge in any of these tools would be a plus: ->CST Studio Suite, Ansys HFSS, Ansys Q3D, Ansys SIwave, Cadence Sigirty
Experience in RF packages fcCSP beneficial

Company

indie Semiconductor

twittertwittertwitter
company-logo
Indie is a technology company focusing on autotech revolution with next generation automotive semiconductors and software platforms.

Funding

Current Stage
Public Company
Total Funding
$322.5M
2022-11-17Post Ipo Debt· $140M
2022-07-25IPO· bvmf:I2ND34
2021-06-11Post Ipo Equity· $150M

Leadership Team

leader-logo
Donald McClymont
Co-Founder and CEO
linkedin
leader-logo
Ichiro Aoki
Co-founder, President and Member of BoD
linkedin
Company data provided by crunchbase
logo

Orion

Your AI Copilot