indie Semiconductor · 3 days ago
Senior Packaging/Assembly Engineer
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Responsibilities
Define advanced package requirements
Select and qualify advanced package technologies, materials and surface mount processes
IC package design and supervision of assembly process
Support package reliability investigations and failure analysis
Support production ramp-up and process optimization programs
Support the selection, evaluation and co-ordination of subcontractor manufacturing
Experience in guiding and controlling external suppliers
Work with foundry and OSAT to bring packaging solution from concept to HVM
Experience in RF packages fcCSP beneficial
Qualification
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Required
Engineering Master’s degree in an electronic or microelectronic field with 5+ years of industrial experience in advanced IC packaging
Excellent interpersonal skills and has strong business partnership building and collaboration with multi-functional teams and overseas suppliers
General understanding of packaging technologies, assembly processes, IC packaging materials, reliability standards, FA techniques, etc.
Professional experience in project management with international partners
Shown capabilities using package design softwares, APD, Altium Designer, Virtuoso, etc.
Preferred
Knowledge in any of these tools would be a plus: ->CST Studio Suite, Ansys HFSS, Ansys Q3D, Ansys SIwave, Cadence Sigirty
Experience in RF packages fcCSP beneficial
Company
indie Semiconductor
Indie is a technology company focusing on autotech revolution with next generation automotive semiconductors and software platforms.
Funding
Current Stage
Public CompanyTotal Funding
$322.5M2022-11-17Post Ipo Debt· $140M
2022-07-25IPO· bvmf:I2ND34
2021-06-11Post Ipo Equity· $150M
Recent News
2024-06-05
2024-06-05
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