26 applicants
Micron Technology · 2 days ago
HBM Memory Subsystem Architect
Atlanta, GA
Full-time
Onsite
Senior Level
$158K/yr - $367K/yr
10+ years exp
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Responsibilities
Help develop innovative new memory subsystem frameworks for HBM solutions targeting AI/ML applications
Includes PHY, memory controllers, NOC, microcontrollers, MBIST, interfaces, adapters, RAS, buffers, etc for various memory types (DDR, LPDDR, HBM)
Responsible for defining Memory and RAS requirements and architecture
Work with internal and external partners for developing novel architectures and defining detailed requirements for all vital IP
Drive the engagement with IP vendors and the selection of various interface and functional IP
Analyze various benchmarks, workloads, and simulation results to identify areas for memory subsystem innovation
Perform performance and performance/watt modeling, estimate gate count, power, area
Create architectural specifications and external-facing documents. Work with partners to generate specifications considering various hardware and protocol standards
Collaborate with the RTL and validation teams to ensure successful and on-time design implementation of all subsystem features
Prepare material for and participate in design reviews related to HBM products and memory subsystems
Collaborate with internal and external partners on architectural decisions, development flows and tools
Participate in performance simulation and benchmarking of features and memory and computing architectures to drive better architectural decision-making
Drive the memory subsystem microarchitecture definition and specification process
Debug performance and functional issues with high-level models, RTL simulation, hard and soft IP, etc
Qualification
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Required
Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
Minimum of 10 years of experience in memory subsystem architecture and design.
Deep understanding of memory controller design and memory types (DDR, LPDDR, GDDR, HBM).
Experience with PHY design and understanding of signal integrity issues.
Proficiency in Network-on-Chip (NoC) architecture and design.
Familiarity with industry-standard bus protocols such as AXI, AMBA, AHB, DFI, HIF, etc
Strong analytical and problem-solving skills
Excellent written and verbal communication skills
Preferred
PhD in a relevant field
Familiarity with EDA tools for design and verification
Practical experience with multi-core systems, coherent interconnects & Industry IO protocol like PCIe/CXL, confidential compute, virtualization & security
Knowledge of serial link protocols (UCIe etc.) is desired
Benefits
Medical, Dental, and Vision Plans
Paid Time-Off
Paid Holidays
Discretionary Bonuses
Equity
Paid Family Leave
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10,001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Trends of Total Sponsorships
2023 (226)
2022 (602)
2021 (563)
2020 (557)
Funding
Current Stage
Public CompanyTotal Funding
$6.15BKey Investors
U.S. Department of Commerce
2024-04-25Grant· $6.1B
2013-09-01Post Ipo Equity· $16M
2010-01-15IPO· nasdaq:MU
Leadership Team
Sanjay Mehrotra
President and CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2024-05-28
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2024-05-27
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2024-05-24
Company data provided by crunchbase
