55 applicants

Company

Molex · 2 days ago

Field Application Engineer - Flexible Printed Circuits

Naperville, IL

Full-time

Remote

Mid Level

$110K/yr - $120K/yr

3+ years exp

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H1B Sponsor Likely

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Responsibilities

Work with the customer to gather Voice of the Customer (VOC) and other critical design requirements.

Review customer design inputs: Schematics, Pinouts, Signal Integrity and Power requirements and determine if the requirements are able to meet the customer’s design objective. Additionally, do the inputs meet Molex Taiwan’s manufacturing capabilities.

Provide design guidance to CAD resources on optimal layout for each customer design, review and approve CAD outputs.

Provide manufacturing guidance to Molex Taiwan design and process engineering teams (as required) to insure NPI designs are manufactured correctly.

Follow product development process, cooperate with cross functional team to support customer product design requirement.

Perform signal integrity measurement or simulation to analyze and support external/ internal customers.

Review costings from Molex Taiwan for accuracy before submitting to BDM for quoting.

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Electrical EngineeringSignal Integrity analysisPower Integrity analysisPCB/FPC designAllegroAltiumSI simulation softwareHFSS simulation softwareFMEADFM reviewsFPC fabrication materialsIPC standardsLab equipment usageSiemens TeamcenterPolarionIPC 2222 certificationMechanical performance knowledgeCircuit design functionality

Required

Bachelor’s degree in Electrical Engineering

3 or more years of Signal and Power Integrity analysis or high-speed signal and power PCB/FPC design experience

Experience laying out circuits with Allegro or Altium

Experience with SI simulation software

Ability to work with cross functional teams at customers and internally, with those teams spread out geographically around the world. (primarily US, Asia, and Europe)

Experience in creating and using FMEA’s and performing DFM reviews.

Knowledge of materials and processes used in FPC fabrication.

Knowledge of IPC standards requirements and how those impact design and fabrication processes.

Knowledge of how to use lab equipment, multi-meter, spectrum analysis, oscilloscope etc.

Preferred

7 or more years of Signal and Power Integrity analysis or high-speed signal and power PCB/FPC design experience

Experience with HFSS simulation software

Experience with Siemens Teamcenter and Polarion

Certified IPC designer, in depth knowledge of IPC 2222 requirements

Experience with HFSS for SI analysis

Knowledge of how circuit design impacts mechanical performance of FPC circuit.

Ability to design in additional functionality beyond just the circuit design.

Benefits

Medical

Dental

Vision

Flexible spending and health savings accounts

Life insurance

ADD

Disability

Retirement

Paid vacation/time off

Educational assistance

Infertility assistance

Paid parental leave

Adoption assistance

Company

Molex

Glassdoor

3.7

Molex is a supplier of electronic interconnects. It is a sub-organization of Koch, Inc..

Founded in 1938

Lisle, Illinois, USA

10001+ employees

http://www.molex.com

H1B Sponsorship

Molex has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)

Distribution of Different Job Fields Receiving Sponsorship

Represents job field similar to this job

Trends of Total Sponsorships

2023 (52)

2022 (72)

2021 (74)

2020 (64)