NVIDIA · 22 hours ago
Senior Package Layout Engineer - Hardware
Maximize your interview chances
Insider Connection @NVIDIA
Get 3x more responses when you reach out via email instead of LinkedIn.
Responsibilities
As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout incorporating system level trade-offs of pins assignment.
Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity
Qualification
Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.
Required
Hold a B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Your validated working knowledge of high-speed design signal integrity practices
Preferred
Proven experience in substrate layout of wire bond and flip chip packages, preferred
Experience using Valor is helpful
Benefits
Equity
Benefits
Company
NVIDIA
NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.
H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2023 (735)
2022 (892)
2021 (696)
2020 (534)
Funding
Current Stage
Public CompanyTotal Funding
$4.09BKey Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2021-02-18Post Ipo Equity· undefined
Recent News
2024-11-21
2024-11-21
GlobeNewswire News Room
2024-11-21
Company data provided by crunchbase