Senior Package Layout Engineer - Hardware @ NVIDIA | Jobright.ai
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NVIDIA · 22 hours ago

Senior Package Layout Engineer - Hardware

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Artificial Intelligence (AI)GPU
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Growth Opportunities
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H1B Sponsor Likelynote
Hiring Manager
Devin Constant
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Responsibilities

As part of a Layout team, you will collaborate to implement high speed/density ASIC packages.
Perform substrate breakout patterns for ASIC packages.
Optimize package pinout incorporating system level trade-offs of pins assignment.
Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite.
Propose layout design trade-offs to the Technical Package Lead for resolution and implementation.
Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance.
Develop symbols and CAD library databases using Cadence APD design tools
Develop methodologies to improve layout productivity

Qualification

Find out how your skills align with this job's requirements. If anything seems off, you can easily click on the tags to select or unselect skills to reflect your actual expertise.

Cadence APDPCB LayoutHigh-speed designSubstrate layoutSiP toolsSignal integrity practicesHDI designsElectrical EngineeringCAD library databasesLayout productivity methodologies

Required

Hold a B.S. Electrical Engineering or equivalent experience
5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus
Significant background with Cadence APD or SiP and/or PCB layout tools (including Constraint Manager)
Your validated working knowledge of high-speed design signal integrity practices

Preferred

Proven experience in substrate layout of wire bond and flip chip packages, preferred
Experience using Valor is helpful

Benefits

Equity
Benefits

Company

NVIDIA is a computing platform company operating at the intersection of graphics, HPC, and AI.

H1B Sponsorship

NVIDIA has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2023 (735)
2022 (892)
2021 (696)
2020 (534)

Funding

Current Stage
Public Company
Total Funding
$4.09B
Key Investors
ARPA-EARK Investment ManagementSoftBank Vision Fund
2023-05-09Grant· $5M
2022-08-09Post Ipo Equity· $65M
2021-02-18Post Ipo Equity· undefined

Leadership Team

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Jensen Huang
CEO and Founder
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Chris Malachowsky
Co-Founder, SVP
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Company data provided by crunchbase
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