Celestial AI · 2 days ago
Package Reliability Engineer
Santa Clara, CA
Full-time
Onsite
Senior Level
$185K/yr - $225K/yr
5+ years expCelestial AI is a pioneering company in the field of Generative AI, focusing on advanced data center infrastructure. They are seeking an experienced Package Reliability Engineer to drive reliability improvements in 2.5D/3D advanced packaging, collaborating with various teams and external partners to ensure the manufacturability and reliability of semiconductor packages.
Semiconductors
Responsibilities
Conduct physics of failure (PoF)-based reliability modeling for 2.5D/3D advanced packaging
Assess package reliability risks from thermal, mechanical, and electrical stressors
Define and execute stress test plans (e.g., thermal cycling, humidity, electromigration) to validate package robustness
Work closely with OSAT partners to drive package reliability improvements, process optimizations, and yield enhancements
Define reliability requirements, review test methodologies, and ensure OSAT compliance with JEDEC and industry standards
Monitor and evaluate OSAT performance in executing reliability qualifications and failure analysis
Support supplier audits and technical reviews to assess manufacturing capabilities and reliability processes
Evaluate and select materials (substrates, dielectrics, adhesives, underfills) for optimal reliability
Analyze CTE mismatches, warpage, delamination, and interfacial adhesion issues
Work with material suppliers and OSATs to qualify new materials for advanced packaging applications
Lead failure mode analysis (FMEA), model-based problem solving (MBPS) and determine root causes of package failures using techniques such as FIB, X-ray, SEM, and TEM
Identify and mitigate interfacial failures, cracking, voiding, electromigration, and stress-induced damage
Drive OSATs and internal teams to implement corrective and preventive actions (CAPA)
Work cross-functionally with internal design, process, and manufacturing teams to define assembly test vehicles and optimize package architectures
Develop and refine design guidelines, process improvements, and reliability best practices
Stay up to date with industry standards (JEDEC, IPC, IEEE, etc.) and implement best practices in package reliability
Qualification
Required
Education: Master's or Ph.D. in Materials Science, Mechanical Engineering, Electrical Engineering, Applied Physics, or a related field
Experience: 5-10 years of hands-on experience in 2.5D/3D advanced packaging reliability
Technical Expertise: Deep understanding of physics of failure (PoF) methodologies for package reliability
Technical Expertise: Strong knowledge of materials science, particularly in interconnects, substrates, and interfaces
Technical Expertise: Proficiency in stress modeling tools (ANSYS, Abaqus, COMSOL, etc.) for thermo-mechanical analysis
Technical Expertise: Experience with failure analysis techniques such as C-SAM, X-ray CT, SEM, TEM, FIB, and EBSD
OSAT Collaboration Experience: Proven track record of working with and driving OSAT partners for package reliability, yield, and continuous quality improvements
OSAT Collaboration Experience: Experience managing OSAT qualifications, failure analysis, and corrective actions
OSAT Collaboration Experience: Familiarity with supplier engagement, reliability testing at OSATs, and package process flows
Industry Knowledge: Familiarity with JEDEC, IPC, IEEE, and MIL-STD reliability standards
Soft Skills: Strong analytical, problem-solving, and cross-functional collaboration skills
Preferred
Experience in heterogeneous integration, fan-out packaging, chiplet architectures
Knowledge of electrical reliability mechanisms (e.g., electromigration, time-dependent dielectric breakdown)
Expertise in AI-driven reliability modeling or machine learning for failure prediction
Benefits
Health, vision, dental and life insurance
Company
Celestial AI
AI is touching our lives and driving breakthroughs in healthcare, finance, autonomous systems, and countless other domains.
51-200 employees
H1B Sponsorship
Celestial AI has a track record of offering H1B sponsorships. Please note that this does not
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2025 (15)
2024 (10)
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Funding
Current Stage
Growth StageLeadership Team
David Lazovsky
Founder, CEO
Recent News
Venture Capital Access Online
2025-03-13
2025-03-13
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