GE Aerospace · 1 day ago
Advanced Lead – SiC/GaN Power Module Packaging Engineer
Pompano Beach, FL
Full-time
Onsite
Mid, Senior Level
$112K/yr - $150K/yr
3+ years expGE Aerospace is a world-leading provider of jet engines, components, and integrated systems for commercial and military aircraft. The Advanced Lead – SiC/GaN Power Module Packaging Engineer will focus on the design of power modules and the optimization and implementation of manufacturing processes for GaN and SiC power modules, ensuring efficient and reliable production.
AerospaceCommercialManufacturing
No H1B
Responsibilities
Collaborate with power module design team, provide insight on the developed module performance using simulation tools
Collaborate with design and R&D teams to ensure manufacturability and scalability of new GaN and SiC power module designs
Develop and optimize manufacturing processes for GaN and SiC power modules, including die attach, wire bonding, encapsulation, and testing
Identify and implement process improvements to enhance yield, efficiency, and reliability of GaN and SiC power module production
Utilize statistical process control (SPC) and other quality tools to monitor and improve process performance
Develop and implement quality control procedures to ensure compliance with industry standards and customer requirements
Conduct root cause analysis and implement corrective actions to address process-related quality issues
Guide the team to maintain detailed process documentation, including process flow diagrams, work instructions, and standard operating procedures (SOPs)
Prepare technical reports and presentations to communicate process development and improvement activities
Train production staff on new processes and equipment
Provide technical support to production teams to resolve process-related issues
Ensure all manufacturing processes comply with safety regulations and company policies
Participate in regular safety audits and risk assessments to identify and mitigate potential hazards
Qualification
Required
Master's degree or higher in Electrical Engineering, Materials Science, Chemical Engineering, or a related field
Minimum of 3 years of experience in semiconductor manufacturing with a focus on power module packaging
Preferred
PhD degree in Electrical Engineering, Mechanical Engineering, Materials Science, Chemical Engineering, or a related field
Experience with GaN and SiC power module manufacturing and packaging technologies
Familiarity with industry standards and regulations related to power electronics
Strong knowledge of semiconductor fabrication processes, materials, and equipment
Excellent problem-solving and analytical skills
Strong communication and interpersonal skills
Ability to work collaboratively in a cross-functional team environment
Benefits
Medical, dental, and vision insurance that begins on the first day of employment
Permissive time off policy for newly hired employees
Generous 401(k) plan
Tuition Reimbursement
Life insurance and disability coverage
Healthcare benefits include medical, dental, vision, and prescription drug coverage
Access to a Health Coach from GE Aerospace
Employee Assistance Program, which provides 24/7 confidential assessment, counseling and referral services
GE Aerospace Retirement Savings Plan
A 401(k) savings plan with company matching contributions and company retirement contributions
Access to Fidelity resources and planning consultants
Tuition assistance
Adoption assistance
Paid parental leave
Disability insurance
Life insurance
Paid time-off for vacation or illness
Company
GE Aerospace
GE Aerospace is a provider of jet and turboprop engines, as well as integrated systems.
10001+ employees
Funding
Current Stage
Public CompanyTotal Funding
$2.01BKey Investors
JobsOhioUS Department of EnergyAir Force Research Laboratory
2025-07-22Post Ipo Debt· $2B
2025-01-10Grant· $9M
2024-04-02IPO
Leadership Team
Amy Gowder
President and CEO Defense and Systems
H. Lawrence Culp
Chairman & CEO, GE Aerospace
Recent News
2026-01-07
2026-01-06
2026-01-06
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