Lead SoC Architect, Automotive (R&D Lab) jobs in United States
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LG Electronics · 5 months ago

Lead SoC Architect, Automotive (R&D Lab)

LG Electronics is a global leader in technology dedicated to creating innovative solutions for a better life. The Lead Architect for Automotive HPC SoC will lead the research and development of high-performance, power-efficient SoC architectures for automotive applications, focusing on in-vehicle infotainment systems and collaborating with various engineering teams to drive innovation in automotive HPC technology.

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H1B Sponsor Likelynote

Responsibilities

Lead High-Performance SoC Architecture: Design high-performance, power-efficient, and reliable SoC architectures specifically for automotive applications, focusing on in-vehicle infotainment systems while ensuring compliance with industry standards and safety regulations
Optimize High-Performance Computing: Collaborate with hardware, software, and firmware engineering teams to integrate and optimize high-performance computing (HPC) functions within the automotive ecosystem, fostering a collaborative development environment
Drive Innovation in Automotive HPC: Explore and drive innovation in automotive HPC technology by investigating emerging trends such as AI, machine learning, and real-time processing to enhance vehicle performance and safety. Architecture heterogeneous compute systems combining CPUs, GPUs, NPUs, and dedicated accelerators for perception, planning, and control algorithms
Demonstrate Leadership in Collaborative Development: Find and apply the best SoC architectures by collaborating with the HQ development teams. Actively engage in discussions to define project goals and deliverables, contributing innovative ideas while ensuring alignment with the HQ’s objectives and overall business goals
Leverage External Partners: Collaborate with external partners, including semiconductor vendors and IP suppliers, to integrate their technologies into our automotive HPC SoCs, ensuring seamless technology incorporation
Stay Informed on Industry Standards: Keep abreast of industry trends, safety standards (e.g., ISO 26262), and regulatory requirements, including security and FFI, to ensure compliance in SoC design

Qualification

SoC designHigh-performance computingAutomotive safety standardsSoftware-hardware co-designAI/ML integrationEmbedded systems developmentPassion for innovationCommunicationProblem-solving skills

Required

MS in Electrical Engineering, Computer Engineering, or a related field
3+ years of experience in SoC design, with a focus on high-performance computing systems
Proven track record in designing and architecting automotive or industrial SoCs
Experience in improving PPA competitiveness of compute subsystems of HPC SoCs
Familiarity with software-hardware co-design methodologies and tools to optimize performance and efficiency
In-depth knowledge of SoC design principles, including CPU (ARM, x86 or RISC-V), GPU, cache-coherent memory subsystems, on-chip interconnect and I/O architectures as well as die-to-die interfaces
Understanding of PCIe I/F and applications
Experience with automotive safety standards (e.g., ISO 26262) and functional safety concepts
Familiarity with EDA tools (e.g., Cadence, Synopsys) and RTL design
Excellent communication and collaboration abilities, with the ability to work effectively across cross-functional teams
Strong problem-solving skills and the ability to think creatively to overcome technical challenges
Passion for innovation and continuous learning

Preferred

A Ph.D. is a plus
Experience in chiplet-based development and verification is highly desirable
Experience in software development for embedded systems, such as RTOS, AUTOSAR, and BSP, is desirable
Experience in AI/ML and real-time processing within SoC architectures is desirable
Knowledge of AI accelerator design for transformer networks or vision transformer is plus
Experience with automotive cybersecurity standard (ISO/SAE 21434) and secure boot architectures is plus
Understanding of PCIe I/F and applications is highly preferred

Benefits

No-cost employee premiums for you and your eligible dependents for competitive medical, dental, vision and prescription benefits.
Auto enrollment with immediate vesting of competitive company matching contributions in a 401(k) Retirement Savings Plan with several investment options.
Generous Paid Time Off program that includes company holidays and a combined bank of paid sick and vacation time.
Performance based Short-Term Incentives (varies by role).
Access to confidential mental health resources to help you and your loved ones improve your quality of life.
Personal fitness goal incentives.
Family orientated benefits such as paid parental leave and support for families raising children with learning, social, behavioral challenges, or developmental disabilities.
Group Rate Life and Disability Insurance.

Company

LG Electronics

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LG Electronics manufactures a wide range of products including televisions, smartphones, and home appliances.

H1B Sponsorship

LG Electronics has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (23)
2024 (27)
2023 (19)
2022 (10)
2021 (10)
2020 (11)

Funding

Current Stage
Public Company
Total Funding
$800M
2024-04-18Post Ipo Debt· $800M
2023-02-01Post Ipo Equity· $0M
2003-01-10IPO

Leadership Team

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Don Kwack
President and CEO
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Hwan Yong
President & CEO - Air Conditioning & Energy Solution Company
Company data provided by crunchbase