Texas Instruments · 5 months ago
High Voltage Packaging Engineering Manager
FORE 12500 TI Boulevard, Dallas, TX, 75243, US
Full-time
Onsite
Senior LevelTexas Instruments is seeking a High Voltage Packaging Engineering Manager. In this role, you will direct development of new package/container requirements and oversee the quality of existing packages/containers for all product groups.
ComputerDSPSemiconductor
Responsibilities
Define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets
Understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
Define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools
Develop new process flows/technologies necessary to create 1st article prototype and also scale to high volume manufacturing
Outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues
Build upon current knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps
Work collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products
Qualification
Required
Master's Degree
Current knowledge of hazards and safety protocols for safe handling, transportation, and use of products
Define, design, develop and scale to volume production high voltage (200-3300V) packages and high-power modules for the Industrial, Automotive, Renewable and Telecom markets
Understand market trends & end equipment system requirements and build these into competitive forward-looking package and module roadmaps
Define solutions across various HV technologies like GaN, SiC, IGBT and Isolation Technologies and validate these using CFD, thermomechanical and electrical parasitic extraction tools
Develop new process flows/technologies necessary to create 1st article prototype and also scale to high volume manufacturing
Outline the package reliability plans, complete testing, summarize failure modes and provide solutions to address issues
Build upon current knowledge of the material supplier landscape (mold compounds, die attach, substrates) for high voltage applications as well as process / equipment integration and must work with various suppliers to provide solutions to meet TI roadmaps
Work collaboratively across worldwide cross functional teams and capable of accelerating development cycles and ensuring rapid time-to market for new products
Company
Texas Instruments
Texas Instruments is a global semiconductor company that manufactures, designs, tests, and sells embedded and analog processing chips.
Founded in 1930
10001+ employees
H1B Sponsorship
Texas Instruments has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (189)
2024 (184)
2023 (148)
2022 (222)
2021 (165)
2020 (179)
Funding
Current Stage
Public CompanyTotal Funding
$13.61BKey Investors
U.S. Department of Commerce
2025-05-20Post Ipo Debt· $1.2B
2024-12-20Grant· $1.61B
2024-05-28Post Ipo Equity· $2.5B
Leadership Team
Richard Templeton
President and Chief Executive Officer
Krunali Patel
Senior vice president and chief information officer
Recent News
2026-01-09
2026-01-07
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