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Analog Devices · 5 months ago

Lead Inspector, Quality Control (3rd Shift)

US, MA, Chelmsford, Alpha

Full-time

Onsite

Mid Level

$26/hr - $36/hr

Analog Devices, Inc. is a global semiconductor leader that bridges the physical and digital worlds. They are seeking a Lead Inspector for the Quality Control team to perform inspections on complex modules and ensure adherence to various standards and procedures.

DSPElectronicsLightingSemiconductor

No H1B

Security Clearance Required

Responsibilities

Inspectors work to support RF microelectronics-manufacturing team by performing inspection of highly complex modules

Visual Inspections, which shall include but not limited to, precap, final, MMIC and wire bond inspections along with proper Data Entry

Documentation Review

Mechanical Dimensions

Ability to accurately read and interpret prints/Source Control Drawings (SCDs)

Familiarity with the following MIL-STDs and IPC Standards:

Printed Circuit Assembly Solder inspection to IPC-A-610

Low & High-Power Visual Inspection to MIL-STD-883, Method 2010

Hybrid Internal Visual Inspection to MIL-STD-883, Method 2017

Printed Circuit Inspection to IPC-A-600

Package Inspection to MIL-STD-883, Method 2009

Die Shear Testing to MIL-STD-883, Method 2019

Wire bond Testing to MIL-STD-883, Method 2011 and 2023

The candidate’s work generally involves the use of the following:

Optical Microscopy Inspection (accounts for majority of time)

Bond Pull/Die Shear Gauge

Go/No-Go gauges

Walking = 30%

Constant sitting = 70%

Lifting up to 25 lbs. – Floor to waist then back to the floor

Lifting up to 10 lbs. – Waist to chest

Lift and Carry up to 10 lbs. – Floor to waist

Qualification

Visual InspectionsMechanical DimensionsMIL-STDIPC StandardsOptical Microscopy InspectionSAP ERP systemsESD Control PlanSafety ProceduresMicroelectronics TrainingEMPOWER Document Control

Required

Ability to work on a wide range of commodities including semiconductors, COTs parts, machined housings, printed circuits boards, PCBAs, and discretes

Demonstrate attainment of necessary skills to become a Quality Inspector

Visual Inspections, which shall include but not limited to, precap, final, MMIC and wire bond inspections along with proper Data Entry

Documentation Review

Mechanical Dimensions

Ability to accurately read and interpret prints/Source Control Drawings (SCDs)

Familiarity with the following MIL-STDs and IPC Standards: Printed Circuit Assembly Solder inspection to IPC-A-610, Low & High-Power Visual Inspection to MIL-STD-883, Method 2010, Hybrid Internal Visual Inspection to MIL-STD-883, Method 2017, Printed Circuit Inspection to IPC-A-600, Package Inspection to MIL-STD-883, Method 2009, Die Shear Testing to MIL-STD-883, Method 2019, Wire bond Testing to MIL-STD-883, Method 2011 and 2023

Use of Optical Microscopy Inspection

Use of Bond Pull/Die Shear Gauge

Use of Go/No-Go gauges

Walking = 30%

Constant sitting = 70%

Lifting up to 25 lbs. – Floor to waist then back to the floor

Lifting up to 10 lbs. – Waist to chest

Lift and Carry up to 10 lbs. – Floor to waist

ESD Control Plan

Safety Procedures

Microelectronics Training

Internal P10N04 Inspection Procedure training will be provided