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CACI International Inc · 5 months ago

Component and Radiation Effects Analysis Engineer

US NJ Florham Park

Full-time

Onsite

Mid, Senior Level

$90K/yr - $190K/yr

5+ years exp

CACI International Inc is seeking a Component and Radiation Effects Analysis Engineer to support the development of the next generation of optical technologies. The role involves electrical hardware design engineering tasks, providing support for EEE components in high-reliability applications, and ensuring compliance with radiation assurance requirements.

Information TechnologyService IndustrySoftware

Comp. & Benefits

No H1B

Security Clearance Required

U.S. Citizen Only

Responsibilities

Work as independent contributor with team leadership in support of electrical hardware design engineering tasks and program objectives

Provide Electrical, Electronic and Electromagnetic (EEE) components/parts support to the hardware design for the High-Reliability, Military, Aerospace and Space flight applications within different mission risk classes and radiation environments

Perform EEE components/parts selection and ensure their radiation hardness per space program contractual PMP (Parts, Materials and Processes) and Radiation Assurance requirements

Responsible for creating and processing EEE COTS parts upgrade screenings per NASA EEE-INST-002 or MSFC-STD-3012 requirements and, test plans, procedures and Non-Standard Parts Approval Requests (NSPARs)

Able to perform reviews and approvals of the Data Packages for the procured EEE flight parts

Responsible for planning of parts Destructive Physical Analysis (DPA) and reviews of DPA reports per MIL-STD-1580 requirements

Responsible for Radiation Lot Acceptance Testing - RLAT (TID, DDD and SEE, as well Flash X-Ray Dose Rate Characterization) budgetary and actual test planning, preparation of SOW for testing with required device electrical limits pass/fail criteria for DUT and review/approval of the test procedure

Conduct detailed TID, DDD and SEE analysis on a piece parts level against program RHA requirements

Qualification

Radiation Effects AnalysisElectrical EngineeringEEE Components ScreeningRadiation HardeningMicrocircuits FabricationAnalogDigital CircuitryMIL Standards KnowledgeTeam LeadershipCommunication Skills

Required

US Citizenship required

Bachelor's Degree in Electrical Engineering (or related) technical discipline and minimum 5 years of prior relevant experience

Must have general knowledge in: Space (LEO, MEO and GEO) Radiation Environments and Sources, and how they impact electronics and circuits

Radiation effects, such as TID (HDR), ELDRS, DDD, Proton and/or Heavy-Ion particles induced SEE and Flash X-Ray Dose

Microcircuits, Hybrids, Semiconductors and Passive Components fabrication (process technologies)

Relationship between radiation effects and different semiconductor fabrication process technologies

Basics of the Analog and Digital Circuitry, including FPGA's and Microprocessors

MIL, Space EEE components screening & qualification levels and applicable MIL standards

Know the difference between NASA Level 1-3 and DLA Class V/Q/P devices, as well as NASA Level 3 vs. Automotive grade passive devices

Radiation Hardening, Survivability, and Mitigation Methods and how they impact electronics and circuits

Radiation Lot Acceptance Testing (RLAT) techniques, test data statistics and device under test statistical sampling (based on KTL) approaches, applicable MIL-STD's, Test Methods and Conditions (for example, MIL-STD-883, TM1019, Cond A or D)

Preferred

Master's degree in electrical engineering (or related) technical discipline and minimum 10 years of prior relevant experience

Good to have the general knowledge in: Hardware design (on the piece parts and boards level) and how Radiation Environments and Sources affect performance on the board and piece part level

Understanding of the EEE parts MIL/Space grades/levels/classes and their relationship with different space mission risk classes (A to D) per applicable MIL standards and NASA guidelines

Familiarity with MIL-STD-1835 for Electronic Component Case Outlines and understanding of Flat Pack (FP) ceramic and plastic (space enhanced) package types, configurations and hermeticity features

Familiarity with FP Lead-forming process, standard and custom case outline specification drawings for the MIL/Space grade device packages (per DLA SMD drawings)

Benefits

Healthcare

Wellness

Financial

Retirement

Family support

Continuing education

Time off benefits

Company

CACI International Inc

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At CACI International Inc (NYSE: CACI), our 25,000 talented and dynamic employees are ever vigilant in delivering distinctive expertise and technology to meet our customers’ greatest challenges in national security.

Founded in 1962

Arlington, Virginia, USA

10001+ employees