NVIDIA ยท 5 months ago
Package Design Engineer
US, CA, Santa Clara
Full-time
Onsite
Mid, Senior Level
3+ years expNVIDIA is a leader in GPU and SOC technology, seeking a passionate Senior Package Design Engineer in their Advanced Technology Group. The role involves leading package test vehicle designs and collaborating with cross-functional teams to implement cutting-edge package technologies.
Computer Hardware Manufacturing
Responsibilities
Your responsibilities will include defining the chip pad ring, substrate interconnect scheme, and lead the package layout design process for package test vehicles
The focus will be primarily on flip chip and 2.5D interposer based packages
Implement electrical/mechanical/thermal structures in test vehicles for effective package technology evaluations
Develop design flow for new package technologies
Collaborate with cross functional teams to incorporate various requirements in package designs
Work with off-shore fab and package assembly manufacturing partners to develop and implement package design rules
Qualification
Required
BS in EE or ME (or equivalent experience)
3+ years package design experience
Strong programming skills (Perl, Python, Tcl desired)
Working knowledge of Cadence Allegro Packaging Design (APD)
Experience in 2.5D packages
Strong problem solving skills
Benefits
Equity
Comprehensive benefits package
Company
NVIDIA
Since its founding in 1993, NVIDIA (NASDAQ: NVDA) has been a pioneer in accelerated computing.
10,001+ employees
H1B Sponsorship
NVIDIA has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (1877)
2024 (1355)
2023 (976)
2022 (835)
2021 (601)
2020 (529)
Funding
Current Stage
Late StageCompany data provided by crunchbase