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Diamond Foundry · 5 months ago

Application Engineering Director

Bay Area, California

Full-time

Onsite

Director/Executive

$180K/yr - $250K/yr

8+ years exp

Diamond Foundry Inc. is a pioneering company focused on producing single-crystal diamond wafers for advanced electronics and thermal management. They are seeking an experienced Application Engineering Director to lead the application engineering function, drive technical development of diamond-based solutions, and collaborate with R&D teams to enhance product offerings in the semiconductor industry.

Consumer GoodsFoundriesSemiconductor

No H1B

Responsibilities

Lead and grow the application engineering function focused on semiconductor packaging and thermal management applications

Drive the technical development, execution, and optimization of diamond-based solutions for advanced packaging and thermal management interfaces, integrating state-of-the-art material solutions and processes

Provide in-depth technical expertise on thermal management principles and material characterization

Collaborate with the R&D and product development teams to define product roadmaps, identify new application opportunities, and drive product improvements

Qualification

Semiconductor packagingThermal managementMaterial characterizationAdvanced packagingHigh thermal conductivity materialsCross-functional team leadershipCommunication skillsPresentation skillsInterpersonal skills

Required

Bachelor's or Master's degree in Materials Science, Chemistry, Electrical Engineering, Mechanical Engineering, or a related field with a minimum of 8+ years of experience in semiconductor packaging and/or thermal management applications

Deep understanding of semiconductor packaging technologies, thermal management principles, and material characterization techniques, including advanced packaging basic understanding, including 2.5D/3D IC thermal solutions

Demonstration of exceptional ability and accomplishments, including hands-on development, integration, troubleshooting, and implementation of solutions

Ability to execute from concepts and R&D to scaling and mass production

Strong knowledge of the semiconductor industry, systems engineering, reliability and compliance demonstration, and technology transfers, particularly in advanced packaging and thermal management

Proven ability to lead and manage cross-functional engineering teams, coupled with excellent communication, presentation, and interpersonal skills to support both internal collaboration and external business development and customer engagement

Experience with high thermal conductivity materials and advanced packaging