Manufacturing Engineer – PIC wafer fabrication jobs in United States
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Nokia · 1 week ago

Manufacturing Engineer – PIC wafer fabrication

Nokia is a global leader in innovation and technology across mobile, fixed, and cloud networks. The role involves optimizing and troubleshooting processes for PIC wafer fabrication, working with teams to enhance production yield and improve process control.

ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
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Culture & Values
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H1B Sponsor Likelynote

Responsibilities

Optimize plasma deposition, plasma etch, wet etch and clean, and related processes needed for PIC wafer fabrication
Work in teams to scale PIC wafer fabrication processes to larger wafer sizes, while meeting key objectives for PIC yield, uniformity, and end-of-line parametric performance
Troubleshoot wafer fabrication process problems to enable a smooth flow of production and development wafers in the fab. Support engineering process and tool owners in resolving fab process or equipment problems
Execute fabrication work and data collection to support process development for etch, and deposition, and photolithography roadmap activities needed for future PIC technology
Utilize metrology equipment and test structures to maintain process control across wafer fab process modules, improve production yield and enable and guide new process development

Qualification

JMPDOESPCSemiconductor fabricationEtch processesDeposition processesPhotolithographyMetrology toolsRoot cause analysisLeadership skillsCommunication skills

Required

B.S degree or equivalent experience
JMP, DOE, SPC and their application to semiconductor manufacturing
Working knowledge of semiconductor fabrication processes, and expertise in etch, deposition, photolithography and related processes
Strong initiative, leadership and communication skills
Experience with semiconductor process development, sustaining, new process introduction, and ramp to volume
Experience supporting a 24x7 fab operations team, writing and training of fab procedures, root cause analysis and problem resolution

Preferred

Technical depth in aspects of, etch, deposition, photolithography or similar tools and processes used for semiconductor manufacturing. 5 years' experience in broad aspects of semiconductor wafer fabrication
Knowledge of wafer fab metrology tools, for example ellipsometry, CD-SEM, step height, and overlay metrology
Clear communication of problems, challenges, and initiative in deploying solutions
A working knowledge and fab experience from pathfinding through mature production
A compound semiconductor background is a plus

Benefits

Corporate Retirement Savings Plan
Health and dental benefits
Short-term disability, and long-term disability
Life insurance, and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and Vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program/Work Life Resource Program

Company

Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.

H1B Sponsorship

Nokia has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)

Funding

Current Stage
Public Company
Total Funding
$4.45B
Key Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B

Leadership Team

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Justin Hotard
President and CEO
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Victoria Hanrahan
Chief of Staff to the CEO
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Company data provided by crunchbase