Rambus · 10 hours ago
SPE, Design Engineering
Rambus is a premier chip and silicon IP provider, seeking to hire an exceptional SPE Design Engineering to join their Memory Interface Chips team in the Johns Creek, Georgia design center. The candidate will be responsible for specifying, architecting, executing, and productizing leading edge memory interface buffer chips for DDR5, DDR6 and beyond.
ArchitectureLightingSemiconductor
Responsibilities
Owner and domain expert of analog, digital, or mixed signal chip and block level designs
Architect, design, simulate and characterize high-performance and low-power circuits for high-speed clocking and data paths, for IOs, for analog support functions, and for DDR protocols
Modeling of chip and block level at various levels of detail for tradeoff analysis of power, performance, area, and schedule metrics
Supervise supporting engineering functions such as layout, physical design, or DFT to ensure implementation aligns with expectations
Work closely with cross-functional teams across different geographies and time zones to ensure engagement and execution
Other responsibilities may include architecture documentation, design documentation, supporting customer interaction, and guiding post silicon activity
Qualification
Required
MSEE/Ph.D. with 10+ years of analog / mixed-signal circuit design experience
Decent understanding of SI/PI principles a must have
Must be a team player with good written and verbal communication skills, self-motivated, thorough design styles, detail oriented, and work with multiple functional teams with good engineering practices
Preferred
Direct chip design experience in DDR product is a strong plus
Experience with Verilog, VerilogA, VerilogAMS coding is a strong plus
Experience with Matlab Simulink modeling is a strong plus
Benefits
Base salary
Bonus
Equity
Matching 401(k)
Employee stock purchase plan
Comprehensive medical and dental benefits
Time-off program
Gym membership
Company
Rambus
Rambus designs, develops and licenses chip interface technologies and architectures that are used in digital electronics products.
H1B Sponsorship
Rambus has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (25)
2024 (16)
2023 (7)
2022 (8)
2021 (3)
2020 (11)
Funding
Current Stage
Public CompanyTotal Funding
$288.57M2023-07-20Acquired
2011-06-07Post Ipo Equity· $88.57M
2010-02-02Post Ipo Equity· $200M
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