Micron Technology · 5 months ago
Principal Process Engineer, APTD Bonding
Boise, ID - Main Site
Full-time
Onsite
Lead/Staff
8+ years expMicron Technology is a world leader in innovating memory and storage solutions. As a Principal Process Engineer in Advanced Packaging, you will be responsible for developing and optimizing processes to improve product quality and reliability, while resolving manufacturing line problems and leading yield improvement initiatives.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Identify, diagnose and resolve assembly process related problems
Coordinate and complete process, equipment, and material evaluation / optimization initiatives and make changes at process step
Lead / participate in continuous yield improvement and cost reduction activities
Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
Support SPC/FDC/RMS/APC
Support site to site portability
Lead audit material suppliers to achieve quality, cost and risk management objectives
Support internal and external audits
Qualification
Required
Bachelor's or Master's degree in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field or equivalent experience
8 years of validated experience in Process Integration/Development or Package Integration within the semiconductor industry
Strong architectural sense to translate process/design into technical requirements and specifications
10 years expertise in data extraction, analysis, and reporting tools such as JMP, Python, R
In-depth understanding of process flows, interactions, and their effects on yield, performance, and reliability
Technical knowledge and experience in Ultra-Thin Die Integration, Thermal Compression Bonding, Die to wafer, and Gap fill technology in a semiconductor environment
Experience in various assembly processes like Dicing, Thinning, Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures
Preferred
Master's or PhD in Materials Science, Chemistry, Physics, Mechanical or Metallurgical Engineering
Benefits
A choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
A robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
2026-01-11
2026-01-11
Company data provided by crunchbase