HARMAN International · 7 hours ago
Principal Engineer – Embedded Software
HARMAN International is seeking a Principal Engineer specializing in firmware development for Audio, Video, and Control products. The role focuses on low-level development for microcontrollers and microprocessors, requiring collaboration across diverse functions to deliver innovative solutions.
AudioConsumerConsumer ElectronicsDSPElectronicsManufacturing
Responsibilities
Design and develop robust and reliable C/C++ firmware for Harman Pro audio, video and control products
Design and develop firmware for the configuration and management of complex, multi-processor products including power management, boot sequencing, signal amplification, inter-processor communications, sub-processor management, and firmware upgrade
Participate in the full lifecycle of product development including design, implementation, board bring-up, signal validation, hardware checkout, and product feature validation
Collaborate with cross functional teams including hardware, software, test, project and product management
Follow engineering standards and best practices for firmware development and code validation
Qualification
Required
Bachelor's degree in electrical engineering, computer engineering or computer science
7+ years of C/C++ programming on multi-threaded embedded platforms and products
7+ years of experience real-time OS's such as FreeRTOS, Zephyr as well as experience with bare-metal firmware development
Experience developing firmware for embedded systems running Linux
Experience with a broad range of communication channels including SPI, I2C, UART, I2S and Ethernet
Experience with different microcontroller and microprocessor architectures
Experience with low-level firmware debugging and signal validation via oscilloscope and logic analyzer
Strong commitment to adhering to all relevant functional policies and best practices and ensuring your work consistently reflects this commitment
Willingness to work in our office in Richardson, TX
Willingness for occasional travel
Successfully complete a background investigation and drug screen as a condition of employment
Preferred
Experience in task break-down, estimation and resource scheduling
Fluency in multiple programming and scripting languages such as Java and Python
Experience with NXP and ST microcontrollers
Experience with audio systems products and firmware
Experience with firmware build environments including cmake
Experience with data exchange methods such as JSON and XML
Understanding of digital signal concepts such as ADC, DAC, PWM
Experience working in a global matrixed organization
Experience using Atlassian Tools (Confluence, Jira, Bitbucket)
Benefits
Competitive wellness benefits and 401K Retirement Savings plan.
An inclusive and diverse work environment that fosters and encourages career development opportunities.
Flexible work schedule with a culture encouraging work-life integration and collaboration in a global environment.
Professional development opportunities through HARMAN University’s business and leadership academies and extensive course catalog.
Tuition Reimbursement.
Access to employee discounts on world-class HARMAN products (JBL, Harman/Kardon, etc.).
“Be Brilliant” employee recognition and rewards program.
An inclusive and diverse work environment that fosters and encourages professional and personal development.
Company
HARMAN International
Headquartered in Stamford, Connecticut, HARMAN (harman.com) designs and engineers connected products and solutions for automakers, consumers, and enterprises worldwide, including connected car systems, audio and visual products, enterprise automation solutions; and services supporting the Internet of Things.
H1B Sponsorship
HARMAN International has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (4)
2024 (6)
2023 (7)
2022 (6)
2021 (7)
2020 (7)
Funding
Current Stage
Public CompanyTotal Funding
unknown2016-11-14Acquired
1986-11-21IPO
Leadership Team
Recent News
2026-01-05
Morningstar.com
2025-12-24
2025-12-24
Company data provided by crunchbase