Micron Technology · 2 weeks ago
Principal Logic Circuit Design Engineer
Folsom, CA
Full-time
Onsite
Senior Level, Lead/Staff
$162K/yr - $344K/yr
7+ years expMicron Technology is a world leader in innovating memory and storage solutions. As a Principal HBM RTL Designer, you will serve as a technical leader driving the front-end digital design of next-generation High Bandwidth Memory (HBM) products, owning complex design blocks and mentoring engineers while ensuring world-class design execution.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Define, architect, and lead the development of advanced RTL blocks for HBM subsystems, ensuring alignment with product requirements and architectural goals
Own end‑to‑end front‑end design, including micro‑architecture, RTL development, simulation strategy, and design quality
Drive technical decisions across circuit development, synthesis, constraints, and physical‑design integration, ensuring timing, power, and area compliance
Guide and review global engineering teams, providing technical leadership across multiple projects and functional areas
Champion design methodologies, develop reusable frameworks, and improve RTL design flows, validation strategies, and sign‑off processes
Collaborate closely with physical design, verification, architecture, and product engineering to integrate subsystems and deliver high‑quality silicon
Lead root‑cause analysis and corrective actions for complex design issues, ensuring long‑term design robustness
Communicate effectively at all levels, contributing to technical planning, project execution, and cross‑organizational alignment
Qualification
Required
Bachelor's degree with 9+ years, or Master's degree with 7+ years of proven experience in digital design and RTL development
Expert-level knowledge of front‑end digital design, RTL coding, micro‑architecture, and system integration
Deep understanding of timing closure, power optimization, area trade-offs, and system-level complexity management
Strong experience with synthesis, STA, constraints, LEC, Lint, CDC, and front‑end sign‑off methodologies
Proven ability to lead technical teams, mentor engineers, and influence design direction across large programs
Exceptional problem-solving, analytical, communication, and technical leadership skills
Preferred
Experience with UPF, power‑intent development, power analysis, DFT/scan insertion, ATPG, and timing model generation
Proficiency in Python, Perl, or scripting to automate and enhance design flows
Familiarity with sophisticated place-and-route tools and back‑end requirements for successful RTL-to-GDS integration
Proven history delivering high‑complexity systems, preferably in memory, high‑speed I/O, or compute‑intensive ASIC designs
Ability to define architectural trade-offs, influence product direction, and guide teams toward scalable and maintainable design solutions
Benefits
Medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
10001+ employees
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Sanjay Mehrotra
Chairman, President & CEO
Gursharan Singh
Senior Vice President BE Operations
Recent News
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