Micron Technology · 2 weeks ago
Principal Systems Design Engineer, HBM
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence. They are seeking a highly experienced Custom Layout and High-Speed I/O Design Engineer to lead full-chip floorplanning and layout development for advanced HBM designs.
ComputerHardwareManufacturingSemiconductor
Responsibilities
Own full-chip floorplanning, design partitioning, and top-level synthesis with multiple hard macro IP blocks
Develop automated high-speed matching routing and ensure timely delivery of high-quality block-level layouts
Perform physical verification (LVS/DRC/Antenna), quality checks, and documentation support
Lead planning, estimation, scheduling, and execution across multiple projects
Guide junior team members in sub-block layout execution and review critical design elements
Collaborate effectively with global engineering teams to ensure layout project success
Understand layout effects on circuit performance (speed, capacitance, power, area)
Contribute to project management and cross-functional communication
Qualification
Required
10+ years of experience in analog/custom layout design across advanced CMOS nodes (Planar, FinFET)
Proficiency in Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS
Hands-on experience with industry APR tools like Innovus or Fusion Compiler
Strong understanding of analog layout fundamentals and parasitic effects
Proven ability to implement high-quality layouts under complex design constraints
Preferred
Excellent verbal and written communication skills
Strong problem-solving skills in physical verification and debug
Experience supporting multiple tape-outs and working with memory design hierarchies
Benefits
Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays
Company
Micron Technology
Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.
H1B Sponsorship
Micron Technology has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)
Funding
Current Stage
Public CompanyTotal Funding
$8.9BKey Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B
Leadership Team
Recent News
2026-01-11
2026-01-11
Company data provided by crunchbase