Embedded DSP Software Engineer, Senior Staff jobs in United States
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Qualcomm · 4 months ago

Embedded DSP Software Engineer, Senior Staff

Qualcomm Technologies, Inc. is a leading technology innovator that enables next-generation experiences and drives digital transformation. As a Senior Staff Embedded DSP Software Engineer, you will design and develop embedded and cloud edge software for Qualcomm's SoC portfolio, collaborating with various engineering teams to deliver high-performance software solutions.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
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Comp. & Benefits
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Responsibilities

Architect, design and develop multimedia frameworks across the processors available on the SoC
Develop high-performance system drivers for compute resources
Work closely with our global team to integrate, test, and commercially support our embedded software
Offsite and occasional onsite work with OEMs and Independent Software Vendors may be required

Qualification

Embedded software developmentC/C++ programmingJava programmingPython programmingTest automationSoftware integrationOperating systemsSystem driversMultimedia frameworks

Required

Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Software Engineering or related work experience
Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Software Engineering or related work experience
PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Software Engineering or related work experience
3+ years of work experience with Programming Language such as C, C++, Java, Python, etc

Preferred

Bachelor's and/or Master's degree in Engineering, Information Systems, Computer Science, or related field
2+ years experience in test automation and software integration

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

Company

Qualcomm

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Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

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Cristiano Amon
President and Chief Executive Officer
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Isaac Eteminan
CEO
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Company data provided by crunchbase