Thermal Engineer jobs in United States
cer-icon
Apply on Employer Site
company-logo

Qualcomm · 5 days ago

Thermal Engineer

Qualcomm Technologies, Inc. is dedicated to transforming the industry by developing next-generation computing platforms. As a Thermal Engineer, you will collaborate with cross-functional teams to conduct thermal simulations and testing, ensuring the performance and energy efficiency of high-performance computing systems.

Artificial Intelligence (AI)Generative AISoftwareTelecommunicationsWireless
check
Comp. & Benefits
check
H1B Sponsor Likelynote

Responsibilities

Perform die/package/system-level thermal modeling to analyze and optimize server package and system thermals
Support thermal design of packages and systems from concept through detailed design and manufacturing readiness
Collaborate with internal teams to provide technical guidance, ensuring alignment with mechanical, packaging, system, and customer requirements
Conduct thermal testing to validate and improve thermal models and solutions, enhancing accuracy and robustness
Research thermal management materials and solutions for advanced electronics
Develop and maintain documentation, guidelines, and tools to support design processes and project success
Prepare and present technical documentation and reports to stakeholders, including engineering teams, senior management, customers, and suppliers

Qualification

Thermal modelingCFD modeling toolsHeat transfer fundamentalsElectronics cooling technologiesPackaging technologiesThermal testingProgramming languagesTechnical documentationCollaboration skillsCommunication skills

Required

Master's degree in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field
5+ years of hands-on experience in thermal modeling within the high-tech industry
Strong background in heat transfer fundamentals, with a solid understanding of conduction, convection, and radiation
Proficiency with CFD modeling tools (e.g., Celsius EC, Flotherm, Icepak)
Understanding of electronics cooling technologies (passive and active)
Knowledge of packaging technologies, server design, and thermal management materials
Proven ability to work independently and collaboratively within a cross-functional team environment
Strong technical documentation skills and excellent written and verbal communication
Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 8+ years of Systems Engineering or related work experience
OR Master's degree in Engineering, Information Systems, Computer Science, or related field and 7+ years of Systems Engineering or related work experience
OR PhD in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience

Preferred

Ph.D. in Mechanical Engineering, Engineering Mechanics, Material Science, or a related field
10+ years of hands-on experience in thermal modeling within the high-tech industry
Understanding of OCP product designs and industry best practices
Engineering design and industry experience with high-end servers
Expertise in conducting CFD simulations with thermal modeling tools (e.g., Celsius EC, Flotherm, Icepak)
Proficiency with thermal testing (e.g., DAQ, LabVIEW, thermocouples, airflow measurements, thermal chambers) for computer hardware
Proficiency in programming languages (e.g., Python, C/C++, MATLAB) for data analysis and tool development
Experience with CAD tools (e.g., SolidWorks, Creo)

Benefits

Competitive annual discretionary bonus program
Opportunity for annual RSU grants
Highly competitive benefits package

Company

Qualcomm

company-logo
Qualcomm designs wireless technologies and semiconductors that power connectivity, communication, and smart devices.

H1B Sponsorship

Qualcomm has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (2013)
2024 (1910)
2023 (3216)
2022 (2885)
2021 (2104)
2020 (1181)

Funding

Current Stage
Public Company
Total Funding
$3.5M
1991-12-20IPO
1988-01-01Undisclosed· $3.5M

Leadership Team

leader-logo
Cristiano Amon
President and Chief Executive Officer
linkedin
I
Isaac Eteminan
CEO
linkedin
Company data provided by crunchbase