Apple · 4 months ago
IC Package Design Engineer
Santa Clara, California, United States
Full-time
Onsite
Mid Level
$147K/yr - $272K/yr
3+ years expApple is a leading technology company known for its innovative consumer electronics. The IC Package Design Engineer will be responsible for implementing and optimizing the physical design of packages and modules for various chips, collaborating with multi-functional teams to ensure optimal performance and functionality.
AppsArtificial Intelligence (AI)BroadcastingDigital EntertainmentFoundational AIMedia and EntertainmentMobile DevicesOperating SystemsTVWearables
Responsibilities
Implement the physical design of packages and modules for SoC, Memory, RF, and cellular chips
Interface and coordinate with multi-functional groups throughout Apple on new product package/SiP/module feasibility analysis, design and selection
Define and develop design verification and automation strategy to strengthen and streamline package design as well as release flows
Work multi-functionally to optimize package pin out
Perform extraction of S-parameters and package RLGC model
Ensure package design is optimized with SI/PI requirements
Drive methodology, innovations, and efficiency improvements in package design together with vendors and developers on feature development and bug resolution
Explore, evaluate and develop new CAD tool, design and verification flow
Partner with Silicon PD team to optimize chip Floorplan and bump placement, and minimize package size
Qualification
Required
BS and 3+ years of relevant industry experience
Preferred
Proven fundamentals in the electrical/material/thermal/ or mechanical engineering field(s)
Familiarity with various sophisticated package configurations and assembly/ substrate technology (wirebond, POP, etc.)
Experience in package design and proficient in Cadence Allegro platform tools (PCB Editor, Advanced Package Designer, APD/SiP) or Mentor Xpedition platform tools
Basic understanding in some SI/PI tools (XtractIM, PowerSI, HFSS, Q3D, etc.), package model extraction, S-parameters and RLGC model
Basic knowledge of substrate manufacturing process, structure, design rules and material property
Proven understanding of high-speed interfaces, including DDR, PCIe, NAND, etc
Exposure to Unix environment, scripting languages (PERL, Python, TCL and or shell) and methodology
Familiarity with CAM350/Valor or Calibre and CAD and experience with package design reviews
Knowledge of high-speed layout constraints (crosstalk mitigation, differential pairs, EMI/RFI, PCB/package resonance)
Design experience with RFIC and 5G packages, SIP or module schematic and layout design experience
Solid understanding of Design Rules Check and Design for Manufacturing
Benefits
Comprehensive medical and dental coverage
Retirement benefits
A range of discounted products and free services
Reimbursement for certain educational expenses — including tuition
Discretionary bonuses or commission payments
Relocation
Company
Apple
Apple is a technology company that designs, manufactures, and markets consumer electronics, personal computers, and software.
10001+ employees
H1B Sponsorship
Apple has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (6998)
2024 (3766)
2023 (3939)
2022 (4822)
2021 (4060)
2020 (3656)
Funding
Current Stage
Late StageTotal Funding
$5.67BKey Investors
Berkshire HathawayMicrosoftSequoia Capital
2026-01-10Pre Seed· $1M
2025-05-05Post Ipo Debt· $4.5B
2025-01-16Post Ipo Debt· $0.31M
Leadership Team
Tim Cook
CEO
Craig Federighi
SVP, Software Engineering
Recent News
Venrock
2025-12-01
2025-09-25
Mac Daily News
2025-09-25
Company data provided by crunchbase