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Oracle · 4 months ago

Senior Principal Thermal Engineer

Austin, TX, United States

Full-time

Onsite

Senior Level, Lead/Staff

10+ years exp

Oracle is seeking a Senior Principal Thermal Engineer to focus on optimizing thermal hardware design for data centers. This role involves collaboration across multiple disciplines to develop cooling strategies and hardware setups, ensuring high performance of data center infrastructure.

Data GovernanceData ManagementEnterprise SoftwareInformation TechnologySaaSSoftware

No H1B

Security Clearance Required

Responsibilities

Build, conduct thermal simulations, and review thermal simulation models from partners to identify data center risks and improve efficiency

Familiarization with Open Compute Design Specifications

Familiarization with Next Generation Fluid Cooling Solutions and Advanced Thermal Designs

Understanding mechanical design process to work with mechanical design engineers on all engineering development efforts

Experience with mechanical validation tests process that may include, Environmental Test Engineering (ETE), Vibration testing & characterization. Familiarity with Electromagnetic Compliance (EMI/EMC) is a plus

Experience in negotiating, establishing, and managing relationships with vendors

Collaborate with internal and external partners across the globe to develop platform hardware and data center infrastructure solutions enabling OCI services

Lead thermal design reviews and presentations of concepts to peers, partner teams, and executives

Proficient with thermal modeling tools at component, server, rack, and data center levels

Engineering analysis of fluid cooling assembly and fit-up engineering verification of various GPU and switch configurations in respective racks

Experience with sourcing and selection of in-row and in-rack CDU’s for high end / high reliability compute solutions

Lead liquid cooling server/ rack designs to support engineering lab and manufacturing tests

Aware of latest fluid cooling industry road map and key technology suppliers. Understand driving factors for deploying different fluid cooling technologies

Experience in design and delivery of direct to chip liquid cooling loops including internal manifolds, cold plates, hoses, and QD’s for high end, high reliability compute systems

Establish a good working relationship with outside suppliers to develop high quality components (e.g., heat-sinks, etc.), and manage thermal/liquid cooling vendor selection process

Oversee the build and validation test process of prototypes

Perform root cause and corrective action analysis as required

Interface with internal and external customers to meet product design intent

Familiar with fluid cooling end assembly (L10/L11) manufacturing challenges and long-term reliability concerns

Work jointly with multidisciplinary teams consisting of both in-house and external partners in the development of Advanced Cooling Solution (ACS) concept prototypes

Engage hardware development organizations to drive concepts to the product roadmap and OCI data center fleet

Collaborate with multifunctional engineering groups to deliver hardware and data center sites aligned with thermal specifications

Collaborate with firmware and controls engineering teams to create robust thermal control and monitoring systems

Conduct design/debug investigations and support failure analysis and resolution activities for platforms and data center infrastructure

Design and create thermal characterization test plans. Collaborate with technicians and industry partners to complete tests. Analyze results to validate compliance with platform and data center infrastructure specifications

Support the high-level thermal design direction and data center strategy for complex systems ranging from advanced computing (HPC, GPU, FPGA Accelerators, etc.) to general purpose compute, storage, network and/or other specialized programs

Create robust, scalable, secure, and extensible thermal architecture solutions that account for current and anticipated industry/competitive needs

Distill and articulate architectural tradeoffs in the thermal space in terms of key metrics such as feasibility, performance, cost, reliability, availability, and schedule

Partner with the platform and data center architects to drive OCI roadmap definitions

Look for opportunities to generate intellectual property to help strengthen OCI’s position as a leader in cloud computing

Drive and influence technology providers and design partners to develop optimal components and solutions to meet the future requirements of the OCI fleet

Partner within the industry and standards bodies to create standards and form factors key to next generation solutions

Collaborate with the hardware development and data center design and construction teams to ensure seamless transition from architecture to implementation

Qualification

Computational Fluid DynamicsThermal Modeling ToolsMechanical Design ProcessFluid Cooling SolutionsData Center InfrastructureMATLAB & SimulinkVendor ManagementCollaborationProblem Solving

Required

10+ years cloud scale provider OR related technical engineering experience AND a Bachelor's Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering

OR 7+ years related cloud scale provider OR technical engineering experience AND Master's Degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering

OR 5+ years related cloud scale provider OR technical engineering experience AND Doctorate degree in Mechanical, Thermal Fluid Science, Systems or Aerospace Engineering

Experience and proficiency in Computational Fluid Dynamics (CFD) analysis and Model Based Design (MBD) analysis

Expertise using Cadence Data Center Solution (aka 6SigmaDCX), OR CoolSim, OR TileFlow, OR AutoDesk CFD, OR ANSYS - Icepak, OR Mentor Graphics FloTHERM

Expertise using MATLAB & Simulink, OpenModelica, Dymola