Apply on Employer Site

MACOM · 4 months ago

Mechanical Engineering, Principal

Lowell, MA

Full-time

Onsite

Lead/Staff

$98K/yr - $167K/yr

8+ years exp

MACOM is a leading designer and manufacturer of semiconductor products for various applications, including Data Center and Telecommunication. The Principal Mechanical Engineer will support new package design and development, ensuring compliance with mechanical requirements and collaborating with cross-functional teams to meet design expectations.

ElectronicsIndustrialInformation TechnologyInternetMachinery ManufacturingManufacturingSemiconductorTechnical SupportWireless

No H1B

Responsibilities

Ownership of the compliance of designs to meet mechanical requirements

Interaction with customers and ability to negotiate requirements where conflicts may occur

Interaction with internal design engineers, project managers, assembly and test entities to ensure all aspects of the design are in-line with expectations across the company

Mechanical analyses including but not limited to structural, thermal and reliability

Ownership and design of assembly and test fixtures

Understanding of machining best practice and GD&T tolerancing

Ability to work with vendors to understand their capabilities in aligning part designs with industry capabilities

Understanding of various manufacturing techniques including subtractive metal fabrication, additive manufacturing, etching, laser cutting, welding and marking, etc

Ability to work in fast paced environment with small and large teams with little-to-no supervision

Qualification

Mechanical Engineering DegreeIC Packaging ExperienceRFMillimeter Wave Experience3D CAD ToolsFinite Element Analysis (FEA)Thermal AnalysisSolidworksAutoCADProblem Solving SkillsCommunication SkillsTeamwork SkillsCritical ThinkingPresentation Skills

Required

Mechanical Engineering Degree or similar with 8+ years of experience in an electronics packaging role

Experience with IC packaging, system and subsystem mechanical design and analysis

Experience with packaging for RF-Power applications, using eutectic and/or sintered epoxy die attach

Experience with aluminum, copper and other alloys for use in packaging and thermal transfer

Understanding and awareness of coefficient of thermal expansion (CTE) matching between various mediums

Understanding of metal plating standards and requirements

Experience in reliability, failure analysis, and quality assurance in advanced package and process development

Experience designing for manufacturing, both internally and externally, both piece-part and assemblies

Intimate knowledge of structural analysis using 3D CAD tools as well as first principles

Intimate knowledge of thermal analysis using 3D CAD tools as well as first principles

Demonstrated ability to lead independent process development

Ability to provide suppliers direction by working with design, assembly, and quality organizations

Familiar with finite element analyses (FEA) required and computational fluid dynamics (CFD) desired

Familiar solving steady state and dynamic thermal problems

Experience using: Solidworks, AutoCad, and PCB layout viewers is ideal

Strong problem solving skills along with good communication, team work, and interpersonal skills

Experience in critical thinking and presentation skills

Experience with supplier and program management roles

Experience working in complex teams to understand and balance all aspects of a design to meet desired outcomes

Ability to balance and prioritize multiple programs and needs simultaneously

Fluent communicator in the English language

Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position

Preferred

Knowledge of product characterization, testing, quality and reliability, including compliance testing and certification is a plus [MIL-PRF-38534, JEDEC, IPC, etc.]