Sr Principal Firmware Engineer jobs in United States
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MKS Inc. · 4 months ago

Sr Principal Firmware Engineer

MKS Inc. is a company specializing in advanced measurement technologies, and they are seeking a Senior Principal Firmware Engineer for their Direct Pressure Measurement group. In this role, you will lead the design and implementation of firmware for embedded metrology products, while engaging with customers to address their challenges and collaborating with cross-functional teams.

Enterprise SoftwareInformation TechnologyManufacturing
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Responsibilities

Leading the architectural design, implementation, verification and validation of firmware for embedded metrology products supporting semiconductor manufacturing and other advanced markets
Engaging with customers to understand their application and integration challenges, and creating advanced features and functionality that drive their success
Supporting the development and diagnostics of the hardware surrounding the processor
Working collaboratively with other software engineers and engineers/scientists of other disciplines to solve challenging problems

Qualification

Embedded system architectureC programmingC++ programmingEtherCatPythonFreeRTOSSTM32 processorsCustomer engagementTeam collaborationProblem solving

Required

Bachelor of Science in Electrical or Computer engineering required
12+ years of experience
Experience leading the development of embedded system architecture and algorithms
Fluency with the C and C++ programming languages
Up to 10% of travel is required
Experience with using emulators, communication bus monitoring hardware/software, oscilloscopes, and similar tools to develop and debug products

Preferred

Experience with EtherCat or comparable field buses
Experience with Python or FreeRTOS
Experience with the STM32 family of processors
Experience designing for semiconductor capital equipment

Company

MKS Inc.

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MKS enables technologies that transform our world.

Funding

Current Stage
Public Company
Total Funding
$4.97B
2024-05-13Post Ipo Debt· $1.37B
2023-10-03Post Ipo Debt· $3.6B
1999-03-30IPO

Leadership Team

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John T.C. Lee
President & Chief Executive Officer
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H
Hossein Zarrin
Director of Product Marketing
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Company data provided by crunchbase