Cadence · 4 months ago
Account Technical Executive: Heterogenous System Design and Analysis
No Seat Req United States
Full-time
Onsite
Senior LevelCadence is a technology company focused on innovation and leadership in the tech industry. They are seeking an Account Technical Executive who will lead technical discussions with customers, manage complex technical campaigns, and foster customer relationships to align solutions with business challenges.
AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
Responsibilities
Must be confident in a technical setting and be able to effectively discuss complex IC and IC packaging related topics with customers and internal stakeholders
This position requires the candidate to utilize his/her exceptional critical thinking and problem-solving skills to understand system-level requirements and work as a team leader at Cadence to resolve technical problems
A strong understanding of IC EDA tools, IC Packaging design, and/or SIPI methodologies and the semiconductor manufacturing eco-system is required
Able to lead complex, technical campaigns across multiple business units and field sales teams
The ability to digest system level block diagrams of existing systems, discuss trade-off decisions and impact, and provide suggestions to make improvements in area’s including integration opportunities, use of advanced IC and packaging technologies, and alternative form factors while considering time to market, cost, risk, thermal, electrical, electromagnetic, and signal integrity performance issues
The ability to foster and grow customer relationships throughout all levels of the customer organization to better connect our solutions with the customer's problems/business challenges and ensure roadmap alignment for long term success
A proven track-record demonstrating the ability to identify and understand customer pain-points and to communicate this to a broad range of technical and non-technical individuals
Able to create and manage customer-level programs, actively tracking progress through customer’s projects and set expectations internally and externally
Qualification
Required
Must be confident in a technical setting and be able to effectively discuss complex IC and IC packaging related topics with customers and internal stakeholders
This position requires the candidate to utilize his/her exceptional critical thinking and problem-solving skills to understand system-level requirements and work as a team leader at Cadence to resolve technical problems
A strong understanding of IC EDA tools, IC Packaging design, and/or SIPI methodologies and the semiconductor manufacturing eco-system is required
Able to lead complex, technical campaigns across multiple business units and field sales teams
The ability to digest system level block diagrams of existing systems, discuss trade-off decisions and impact, and provide suggestions to make improvements in areas including integration opportunities, use of advanced IC and packaging technologies, and alternative form factors while considering time to market, cost, risk, thermal, electrical, electromagnetic, and signal integrity performance issues
The ability to foster and grow customer relationships throughout all levels of the customer organization to better connect our solutions with the customer's problems/business challenges and ensure roadmap alignment for long term success
A proven track-record demonstrating the ability to identify and understand customer pain-points and to communicate this to a broad range of technical and non-technical individuals
Able to create and manage customer-level programs, actively tracking progress through customer's projects and set expectations internally and externally
Preferred
Experience using some of these methods in production use is highly preferred
Company
Cadence
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
Founded in 1988
10001+ employees
H1B Sponsorship
Cadence has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)
Funding
Current Stage
Public CompanyTotal Funding
unknown1998-02-20IPO
Leadership Team
Paul Cunningham
Senior Vice President and General Manager
Tom Beckley
Senior Vice President, Custom IC & PCB Group
Recent News
2026-01-07
2026-01-06
Company data provided by crunchbase