Cadence · 2 weeks ago
Account Technical Executive: Heterogenous System Design and Analysis
Seat Pleasant, MD
Full-time
Hybrid
Senior Level, Lead/Staff
10+ years expCadence is a company that hires and develops leaders and innovators in technology. The Account Technical Executive will utilize technical knowledge to address customer challenges in the semiconductor industry, collaborating with various stakeholders to lead complex campaigns.
AerospaceElectronic Design Automation (EDA)HardwareMobileSemiconductorSoftware
Responsibilities
Utilize technical knowledge to garner deep insights of customer challenges
Collaborate closely with customers, executives, multiple business units and field sales to maximize the value of Cadence System Design solutions
Lead complex campaigns at key customers in the 2.5D and 3DIC multi-die and advanced packaging market
Leverage unique and proven system design, system analysis and thermal/stress tools and methodologies
Discuss complex IC and IC packaging related topics with customers and internal stakeholders
Utilize exceptional critical thinking and problem-solving skills to understand system-level requirements
Work as a team leader at Cadence to resolve technical problems
Lead complex, technical campaigns across multiple business units and field sales teams
Digest system level block diagrams of existing systems, discuss trade-off decisions and impact, and provide suggestions for improvements
Foster and grow customer relationships throughout all levels of the customer organization
Create and manage customer-level programs, actively tracking progress through customer’s projects and set expectations internally and externally
Qualification
Required
Must have a BSEE or MSEE and 10 years industry experience
Must be located in the US
35% travel
Must be confident in a technical setting and be able to effectively discuss complex IC and IC packaging related topics with customers and internal stakeholders
This position requires the candidate to utilize his/her exceptional critical thinking and problem-solving skills to understand system-level requirements and work as a team leader at Cadence to resolve technical problems
A strong understanding of IC EDA tools, IC Packaging design, and/or SIPI methodologies and the semiconductor manufacturing eco-system is required
Able to lead complex, technical campaigns across multiple business units and field sales teams
The ability to digest system level block diagrams of existing systems, discuss trade-off decisions and impact, and provide suggestions to make improvements in area's including integration opportunities, use of advanced IC and packaging technologies, and alternative form factors while considering time to market, cost, risk, thermal, electrical, electromagnetic, and signal integrity performance issues
The ability to foster and grow customer relationships throughout all levels of the customer organization to better connect our solutions with the customer's problems/business challenges and ensure roadmap alignment for long term success
A proven track-record demonstrating the ability to identify and understand customer pain-points and to communicate this to a broad range of technical and non-technical individuals
Able to create and manage customer-level programs, actively tracking progress through customer's projects and set expectations internally and externally
Preferred
Experience using some of these methods in production use is highly preferred
Company
Cadence
Cadence is a market leader in AI and digital twins, pioneering the application of computational software to accelerate innovation in the engineering design of silicon to systems.
10001+ employees
H1B Sponsorship
Cadence has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (306)
2024 (221)
2023 (282)
2022 (330)
2021 (233)
2020 (209)
Funding
Current Stage
Public CompanyTotal Funding
unknown1998-02-20IPO
Leadership Team
Paul Cunningham
Senior Vice President and General Manager
Tom Beckley
Senior Vice President, Custom IC & PCB Group
Recent News
2026-01-07
2026-01-06
Company data provided by crunchbase