Qorvo, Inc. · 4 months ago
Packaging Engineering Intern
Greensboro, NC
Internship
Onsite
Intern
$31/hr - $42/hrQorvo, Inc. is a leading provider of innovative semiconductor solutions across various high-growth markets. They are seeking a Packaging Engineering Intern to assist with Advanced Packaging and Substrate Technology Development projects, while gaining hands-on experience in semiconductor assembly processes.
Network HardwareSemiconductorWireless
No H1B
Responsibilities
Learn about Advanced Packaging and Substrate Technology Development projects methodologies - to help and improve the process
Learn about Substrate Design Rules and Manufacturing Processes - Foster and mentoring
Review Assembly and Marking diagram - look for opportunities to improve
Plan and execute Design of Experiments in support of project deployment
Onsite hands-on learning semiconductor assembly processes -
Other minor activities related to documentation and continuous improvement (A3s - Lean)
Qualification
Required
BS in Materials Science, Chemical, Mechanical, or Electrical Engineering
Mechanical/Material/Chemical/Electrical Engineering skills
Communication and presentation skills
Ability to manage and drive problem resolution
Demonstrate strong analytical thinking skills
3.0 GPA or higher
Preferred
Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred
Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred
Benefits
Challenging, skill-building assignments
Mentoring and coaching from industry experts
Launch & Learns and other learning opportunities
Collaborative team-based work environment
Networking and social events
Final presentation to business leaders
Company
Qorvo, Inc.
Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible.
Founded in 2015
5001-10000 employees
Funding
Current Stage
Public CompanyTotal Funding
$350MKey Investors
Starboard Value
2025-10-28Acquired
2025-01-16Post Ipo Equity
2019-09-30Post Ipo Debt· $350M
Leadership Team
Robert Bruggeworth
CEO
Debra Howard
Senior Vice President and Chief Human Resources Officer
Recent News
eeNews Europe
2025-12-30
Company data provided by crunchbase