Nokia · 2 weeks ago
Optical Packaging Engineer
Nokia is committed to innovation and technology leadership across mobile, fixed and cloud networks. They are seeking a talented Optical Packaging Engineer to lead the development of next-generation optical solutions, collaborating with cross-functional teams to optimize optical coupling efficiency and ensure a smooth transition to mass production.
ElectronicsEnterprise SoftwareInternet of ThingsMobile DevicesTelecommunications
Responsibilities
Lead next generation optical package design in collaboration with cross-functional teams, stakeholders and vendors to ensure package requirements are met
Own all the development of all the optical coupling activities and designs: fiber pigtail, lens coupling, free space optics, etc…
Optimize the optical coupling efficiency of optical engines and apply Design for Manufacturing principles to meet production volumes and cost targets
Survey advanced optical coupling solutions, materials and vendors to stay current with new technological advancements
Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products
Drive package debug activities during product validation and qualification
Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production
Qualification
Required
2-4 years of experience
Experience in high-speed electronics package design and laser package design
Experience with optical coupling, fiber pigtail attachment, free space optics
Experience in microelectronics, optoelectronics packaging design and assembly
Knowledgeable in packaging technologies and processes, with glass/ceramic/metal material properties and multilayer materials interfaces after bonding
Experience with documentation of fabrication, inspection, and assembly processes
Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively
Experience with package and process design/development from design to production
Preferred
Knowledgeable in materials property and process, yield analysis and enhancement, failure mode and analysis, quality tools, such as DOE, SPC, and Six-Sigma process and analysis; Familiar with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc
Expertise in high-volume packaging of 2.5/ 3D packages
Knowledge of material properties and associated mechanical part fabrication processes
Familiar with flipchip, BGA, PCBA, Flex design reliability and processing
Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging - or equivalent practical work experience
Benefits
Corporate Retirement Savings Plan
Health and dental benefits
Short-term disability, and long-term disability
Life insurance, and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and Vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program/Work Life Resource Program
Company
Nokia
Nokia manufactures mobile devices, network infrastructure, and location-based technology for businesses. It is a sub-organization of Enscryb.
H1B Sponsorship
Nokia has a track record of offering H1B sponsorships. Please note that this does not
guarantee sponsorship for this specific role. Below presents additional info for your
reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (262)
2024 (264)
2023 (259)
2022 (250)
2021 (296)
2020 (287)
Funding
Current Stage
Public CompanyTotal Funding
$4.45BKey Investors
European Investment BankNVIDIANational Telecommunications and Information Administration
2025-12-16Post Ipo Debt· $511.84M
2025-10-28Post Ipo Equity· $1B
2025-06-30Post Ipo Debt· $1.76B
Recent News
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2026-01-12
2026-01-12
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