Principal HBM Design Architect jobs in United States
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Micron Technology · 4 months ago

Principal HBM Design Architect

Micron Technology is a world leader in innovating memory and storage solutions. As a Principal HBM Design Architect, you will be responsible for the design and development of high-speed interfaces between DRAM and Base die in HBM cubes, collaborating with a creative development team to build groundbreaking HBM products.

ComputerHardwareManufacturingSemiconductor
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H1B Sponsor Likelynote

Responsibilities

Responsible for the high-speed DRAM and Base die interface in HBM cube
Design the DRAM command and control logic, as well as serializing and de-serializing scheme at the interface
Conduct circuit simulations using standard industry simulators such as FINESIM, HSPICE and VERILOG
Collaborate with data path design on floor planning and full chip testbench
Analyze timing/area/power in high-speed DRAM or mixed-signal design
Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits

Qualification

DRAM operationJEDEC specificationsAnalog designMixed-signal designDRAM command decodingProblem-solvingCommunication skillsCollaboration

Required

Minimum 10+ years of proven experience in the Memory industry with an MS degree or 15+ years with a BS degree or equivalent experience
Extensive experience with DRAM operation and JEDEC specifications, preferably with DDR/LPDDR/GDDR/HBM product family
In depth technical expertise in analog and mixed-signal design
Hands-on experience in DRAM Command decoding, bank logic, and RAS/CAS chain design is highly desired
Proven track record of innovation and problem-solving in high-performance memory development
Excellent problem-solving and analytical skills
An initiative-taking, hardworking collaborator who enjoys working with others
Excellent communication skills with the ability to convey sophisticated technical concepts to other design and verification peers in verbal and written form

Benefits

Choice of medical, dental and vision plans
Benefit programs that help protect your income if you are unable to work due to illness or injury
Paid family leave
Robust paid time-off program
Paid holidays

Company

Micron Technology

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Micron Technology is a semiconductor company that produces DRAM, SDRAM, flash memory, SSD and CMOS image sensing chips.

H1B Sponsorship

Micron Technology has a track record of offering H1B sponsorships. Please note that this does not guarantee sponsorship for this specific role. Below presents additional info for your reference. (Data Powered by US Department of Labor)
Distribution of Different Job Fields Receiving Sponsorship
Represents job field similar to this job
Trends of Total Sponsorships
2025 (573)
2024 (429)
2023 (299)
2022 (626)
2021 (564)
2020 (538)

Funding

Current Stage
Public Company
Total Funding
$8.9B
Key Investors
U.S. Department of Commerce
2025-04-24Post Ipo Debt· $1.75B
2025-01-16Post Ipo Debt· $1B
2024-04-18Grant· $6.1B

Leadership Team

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Sanjay Mehrotra
Chairman, President & CEO
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Gursharan Singh
Senior Vice President BE Operations
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Company data provided by crunchbase